当前位置: X-MOL 学术Proc. Inst. Mech. Eng. E J. Process Mech. Eng. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Numerical investigation of heat transfer and fluid flow characteristics in circular wavy microchannel with tangentially branched secondary channels
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering ( IF 2.4 ) Pub Date : 2019-08-12 , DOI: 10.1177/0954408919869543
Valaparla Ranjith Kumar 1 , Karthik Balasubramanian 1 , K Kiran Kumar 1 , Kanishk Bhatia 1 , Nikhil Tiwari 1
Affiliation  

Electronic devices have become a crucial part of our life. From huge prime movers to small gadgets, everything is electronically driven. The trend from quite some time has been on the miniaturization of these devices and the increase of their power density. Along with that, we also have to keep their temperature below some critical value or else they would become inefficient and unreliable. Fluctuating temperature values, the presence of hotspots, etc. will cause thermal stresses and hence, shorten their life and may even lead to a sudden failure.1 Due to the rapid development of technology and the miniaturization of electronic devices, various traditional cooling technologies are unable to meet their required cooling effect. Thermal management of these electronic devices plays a major role in their effective working. For the thermal management of these electronic devices, an innovative cooling technology i.e. microchannel heat sink cooling technology was first proposed and developed by Tuckerman and Pease2 in 1981. To overcome this difficulty, several other cooling technologies were suggested.3,4 Among those, liquid cooling technology5,6 has major benefits with respect to other technologies. One of these is its high heat transfer rate. Hassan et al.7 reviewed the heat transfer and fluid flow characteristics in single and two-phase flows in microchannels. They noticed that water was used as a working fluid in most of the studies. It is due to its high thermal conductivity and is compatible with most of the channel materials. Jang et al.8 numerically compared the working performances of liquid cooling technologies and air cooling technologies which adopted to cool the three-dimensional multicore processor. They observed that liquid cooling technologies decrease its temperature by 45 ℃.

中文翻译:

切向分支的圆形波浪形微通道传热和流体流动特性的数值研究

电子设备已成为我们生活中至关重要的部分。从巨大的原动机到小配件,一切都由电子驱动。相当一段时间以来的趋势一直是这些设备的小型化及其功率密度的增加。除此之外,我们还必须将其温度保持在某个临界值以下,否则它们将变得效率低下且不可靠。温度值的波动,热点的存在等都会引起热应力,从而缩短其寿命,甚至可能导致突然的故障。1个由于技术的飞速发展和电子设备的小型化,各种传统的冷却技术无法满足其所需的冷却效果。这些电子设备的热管理在其有效工作中起着重要作用。对于这些电子设备的热管理,Tuckerman和Pease 2于1981年首次提出并开发了一种创新的冷却技术,即微通道散热器冷却技术。为克服这一困难,提出了其他几种冷却技术。3,4其中,液体冷却技术5,6与其他技术相比具有重大优势。其中之一是其高传热速率。哈桑等。7回顾了微通道中单相和两相流的传热和流体流动特性。他们注意到,在大多数研究中,水都被用作工作流体。这是由于其高导热性,并且与大多数通道材料兼容。Jang等。图8数值比较了用于冷却三维多核处理器的液体冷却技术和空气冷却技术的工作性能。他们观察到,液体冷却技术将其温度降低了45℃。
更新日期:2020-01-04
down
wechat
bug