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A Logic-on-Memory Processor-System Design with Monolithic 3D Technology
IEEE Micro ( IF 3.6 ) Pub Date : 2019-11-01 , DOI: 10.1109/mm.2019.2944330
Sai Pentapati 1 , Lingjun Zhu 1 , Lennart Bamberg 2 , Da Eun Shim 1 , Alberto Garcia-Ortiz 2 , Sung Kyu Lim 1
Affiliation  

In recent years, the size of transistors has been scaled down to a few nanometers and further shrinking will eventually reach the atomic scale. Monolithic three-dimensional (M3D) ICs use the third dimension for placement and routing, which helps reduce footprint and improve power and performance of circuits without relying on technology shrinking. This article explores the benefits of M3D ICs using OpenPiton, a scalable open-source Reduced Instruction Set Computer (RISC)-V-based multicore SoC. With a logic-on-memory 3-D integration scheme, we analyze the power and performance benefits of two OpenPiton single-tile systems with smaller and larger memory architectures. The logic-on-memory M3D design shows 36.8% performance improvement compared to the corresponding tile design in 2-D. In addition, at isoperformance, M3D shows 13.5% total power saving.

中文翻译:

采用单片 3D 技术的内存逻辑处理器系统设计

近年来,晶体管的尺寸已经缩小到几纳米,进一步缩小最终将达到原子尺度。单片三维 (M3D) IC 使用三维布局和布线,这有助于在不依赖技术缩小的情况下减少占用空间并提高电路的功率和性能。本文探讨了使用 OpenPiton 的 M3D IC 的优势,OpenPiton 是一种基于可扩展的开源精简指令集计算机 (RISC)-V 的多核 SoC。通过内存上逻辑 3-D 集成方案,我们分析了两个具有更小和更大内存架构的 OpenPiton 单块系统的功率和性能优势。与 2-D 中的相应瓦片设计相比,内存逻辑 M3D 设计的性能提高了 36.8%。此外,在同等性能​​下,M3D 显示总功耗为 13.5%。
更新日期:2019-11-01
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