Abstract

The mechanical properties of Sn-58 wt.% Bi solder with different amounts (0 wt.%, 0.05 wt.%, 0.1 wt.%, and 0.2 wt.%) of Ag-decorated multiwalled carbon nanotube (MWCNT) nanoparticles under 85°C/85% relative humidity environmental conditions for 0 h to 1000 h was investigated. Sn-58 wt.% Bi solder is a lead-free option for use in solder joints due to its low melting temperature and good creep resistance; however, it is brittle and has reliability issues. Ag-decorated MWCNT nanoparticles were used to improve these weaknesses of Sn-58 wt.% Bi solder. A ball shear test was performed using a bond tester to investigate the solder's mechanical properties. The microstructures of the solder joints and fracture mode were analyzed using a field-emission scanning electron microscope. The results demonstrated that the addition of Ag-decorated MWCNT nanoparticles to Sn-58 wt.% Bi increased the shear strength and fracture energy by approximately 15% and 14%, respectively, compared with Sn-58 wt.% Bi alone. After a high-temperature, high-humidity test for 1000 h, the shear strength and fracture energy of Sn-58 wt.% Bi with 0.1 wt.% Ag-decorated MWCNT nanoparticles were 13% and 21% greater than for Sn-58 wt.% Bi alone.

中文翻译：

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Ag修饰的多壁碳纳米管在85°C / 85％相对湿度环境下的Sn-58 wt。％Bi焊料的微观结构和力学性能

摘要

Sn-58 wt。％Bi焊料的机械性能在85℃下具有不同数量（0 wt。％，0.05 wt。％，0.1 wt。％和0.2 wt。％）的带有Ag修饰的多壁碳纳米管（MWCNT）纳米颗粒研究了0h至1000 h的°C / 85％相对湿度环境条件。Sn-58 wt。％Bi焊料具有低熔化温度和良好的抗蠕变性，是用于焊点的无铅选择。但是，它很脆并且存在可靠性问题。用Ag装饰的MWCNT纳米颗粒改善了Sn-58 wt。％Bi焊料的这些弱点。使用粘结测试仪进行了球形剪切测试，以研究焊料的机械性能。使用场发射扫描电子显微镜分析了焊点的微观结构和断裂模式。结果表明，与单独使用Sn-58 wt。％的Bi相比，向Sn-58 wt。％的Bi中添加装饰有Ag的MWCNT纳米颗粒分别使剪切强度和断裂能分别增加了约15％和14％。经过高温高湿测试1000小时后，含0.1 wt。％Ag的MWCNT纳米颗粒的Sn-58 wt。％Bi的剪切强度和断裂能比Sn-58高13％和21％单独的重量％Bi。