Abstract

This paper highlights the advantages of using the nanoindentation approach over the conventional method for the mechanical characterization of components used in electronic packaging. The limitation of the conventional method has become more critical with the miniaturization of electronic packages, giving inadequate information regarding the mechanical properties of metallurgical interconnections. The load–displacement approach via nanoindentation was used in this study to determine the micromechanical properties of a fine-pitch solder joint subjected to aging for 1000 hours. This approach is more advantageous than tensile testing, as it focuses on the elastic behavior unlike that in conventional mechanical testing. The nanoindentation analysis results showed that the elastic–plastic behavior before failure can be assessed in a wide range of temperatures and thus help study the temperature dependence on the mechanical properties of fine-pitch solder joints. The characterization was done beyond the elastic range beforehand of conventional method. The modulus and hardness of the fine-pitch SAC 0307 solder joint decreased while its plastic and elastic behaviors became pronounced at higher aging temperatures. This implies that solder joints become weaker and less resilient with increasing temperature, at least for a duration of 1000 hours.

中文翻译：

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纳米压痕法研究细间距SAC 0307焊点的弹塑性特性与温度的关系

摘要

本文重点介绍了使用纳米压痕方法优于常规方法对电子包装中使用的组件进行机械表征的优势。随着电子封装的小型化，常规方法的局限性变得更加关键，从而给出了关于冶金互连的机械性能的信息不足。载荷-位移法通过在这项研究中，使用了纳米压痕来确定经受1000小时老化的细间距焊点的微机械性能。与传统的机械测试不同，此方法比拉伸测试更具优势，因为它专注于弹性行为。纳米压痕分析结果表明，可以在很宽的温度范围内评估破坏前的弹塑性行为，从而有助于研究温度对细间距焊点力学性能的依赖性。表征超出了常规方法的弹性范围。在较高的时效温度下，细间距SAC 0307焊点的模量和硬度降低，而其塑性和弹性行为则明显。