A new 3D process is proposed for inertial MEMS sensors where a thin transduction layer based on high-density surface-varying comb fingers, with nano-metric gaps, is patterned below a thick seismic mass layer. The objective is to achieve high-performance in a reduced footprint. An in-plane accelerometer is designed, fabricated with this new 3D process, and tested under acceleration. Initial fabricated devices demonstrate a full-scale range of ±160 g, $7~\mu {g}/ \sqrt {\textit {Hz}}$ Brownian noise floor and more than 4 kHz bandwidth. These figures translate into a dynamic range of more than 150 dB (normalized to 1-Hz bandwidth) with an overall footprint of only ${400}\times {600}\,\,\mu {m}^{{2}}$ .

中文翻译：

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采用 3D 工艺的四分之一平方毫米高动态范围硅电容式加速度计。

为惯性 MEMS 传感器提出了一种新的 3D 工艺，其中基于高密度表面变化梳指的薄换能层具有纳米级间隙，在厚地震质量层下方形成图案。目标是在减少占用空间的情况下实现高性能。平面内加速度计是用这种新的 3D 工艺设计和制造的，并在加速度下进行测试。最初制造的设备展示了 ±160 g 的满量程范围， $7~\mu {g}/ \sqrt {\textit {Hz}}$ 布朗底噪和超过 4 kHz 的带宽。这些数字转化为超过 150 dB（归一化为 1-Hz 带宽）的动态范围，总占地面积仅为 ${400}\times {600}\,\,\mu {m}^{{2}}$ .