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A Throughput Study for Channel Bonding in IEEE 802.11ac Networks
IEEE Communications Letters ( IF 4.1 ) Pub Date : 2017-12-01 , DOI: 10.1109/lcomm.2017.2747511
Mun-Suk Kim 1 , Tanguy Ropitault 1 , Nada Golmie 1 , Sukyoung Lee 2
Affiliation  

Several analytical models for the channel bonding feature of IEEE 802.11ac have previously been presented for performance estimation, but their accuracy has been limited by the assumptions that there are no collisions or all nodes are in saturated state. Therefore, in this letter, we develop an analytical model for the throughput performance of channel bonding in IEEE 802.11ac, considering the presence of collisions under both saturated and non-saturated traffic loads, and our numerical results were validated by a simulation study.

中文翻译:

IEEE 802.11ac 网络中信道绑定的吞吐量研究

IEEE 802.11ac 信道绑定特性的几个分析模型之前已经被提出用于性能估计,但它们的准确性受到不存在冲突或所有节点都处于饱和状态的假设的限制。因此,在这封信中,我们针对 IEEE 802.11ac 中信道绑定的吞吐量性能开发了一个分析模型,考虑到在饱和和非饱和流量负载下存在冲突,我们的数值结果通过仿真研究得到验证。
更新日期:2017-12-01
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