The study of electromigration (EM) in metallisations for flexible thin film systems has not been a major concern due to low applied current densities in today's flexible electronic devices. However, the trend towards smaller and more powerful devices demands increasing current densities for future applications, making EM a reliability matter. This work investigates EM in 50 nm Au thin films with a 10 nm Cr adhesion layer on a flexible polyimide substrate at high current densities. Results indicate that EM does occur and could be used as a self-healing mechanism for flexible electronics.

中文翻译：

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柔性聚酰亚胺基板上金膜中的电迁移作为自修复机制。

柔性薄膜系统中金属化过程中电迁移（EM）的研究尚未引起人们的广泛关注，原因是当今的柔性电子设备中的应用电流密度较低。但是，朝着更小巧，功能更强大的设备发展的趋势要求为将来的应用增加电流密度，这使得EM成为可靠性问题。这项工作研究了在高电流密度下在柔性聚酰亚胺衬底上具有10 nm Cr粘附层的50 nm Au薄膜中的EM。结果表明，EM确实会发生，并且可以用作柔性电子设备的自愈机制。