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Enthalpies of mixing of liquid systems for lead free soldering: Co–Sb–Sn
Intermetallics ( IF 4.4 ) Pub Date : 2012-04-01 , DOI: 10.1016/j.intermet.2011.12.023
A Elmahfoudi 1 , A Sabbar 2 , H Flandorfer 3
Affiliation  

The partial and integral enthalpy of mixing of molten ternary Co–Sb–Sn alloys was determined performing high temperature drop calorimetry in a large compositional range at 1273 K. Measurements have been done along five sections, xSb/xSn ≈ 1:1, xSb/xSn ≈ 1:3, xSb/xSn ≈ 3:1, xCo/xSn ≈ 1:4, and xCo/xSb ≈ 1:5. Additionally, binary alloys of the constituent systems Co–Sb and Co–Sn were investigated at the same temperature. All the binary data were evaluated by means of a standard Redlich–Kister polynomial fit whereas ternary data were fitted on the basis of an extended Redlich–Kister–Muggianu model for substitutional solutions. An iso-enthalpy plot of the ternary system was constructed. In addition, the extrapolation Model of Toop was applied and compared to our data.

中文翻译:

用于无铅焊接的液体系统混合焓:Co-Sb-Sn

熔融三元 Co-Sb-Sn 合金的部分和整体混合焓是通过在 1273 K 的大成分范围内进行高温滴量热法确定的。测量已沿五个部分进行,xSb/xSn ≈ 1:1,xSb/ xSn ≈ 1:3,xSb/xSn ≈ 3:1,xCo/xSn ≈ 1:4,xCo/xSb ≈ 1:5。此外,在相同温度下研究了组成系统 Co-Sb 和 Co-Sn 的二元合金。所有二元数据均通过标准 Redlich-Kister 多项式拟合进行评估,而三元数据则基于替代解的扩展 Redlich-Kister-Muggianu 模型拟合。构建了三元系统的等焓图。此外,还应用了 Toop 的外推模型并与我们的数据进行了比较。
更新日期:2012-04-01
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