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Journal of Manufacturing Processes
基本信息
期刊名称 Journal of Manufacturing Processes
J MANUF PROCESS
期刊ISSN 1526-6125
期刊官方网站 http://www.journals.elsevier.com/journal-of-manufacturing-processes/
是否OA
出版商 Elsevier BV
出版周期
始发年份
年文章数 401
最新影响因子 5.01(2020)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 ENGINEERING, MANUFACTURING 工程:制造3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 4.04 1.188 2.118
Decision Sciences
Management Science and Operations Research
18 / 148 88%
Engineering
Industrial and Manufacturing Engineering
39 / 323 88%
Business, Management and Accounting
Strategy and Management
44 / 397 89%
补充信息
自引率 19.60%
H-index 28
SCI收录状况 Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1526-6125%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/smejmp/
收稿范围

Manufacturing is undergoing major transformation due to the unforeseen challenges arising from the current trend of miniaturization, the emergence of new materials and the growing interaction between biologists and engineers to learn more from nature and living objects. 

Traditionally, a "top-down" approach has been used in manufacturing. Recently, engineers and scientists have begun exploring "bottom-up" approaches for manufacturing today's highly complex products. Further, these emerging processes are aimed to improve process efficiency and product quality. 

The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published. 

Papers relevant to the scope of JMP include, but are not limited to, the following areas:


 Meso/micro/nano fabrication, including imprint lithography. 
 Advanced manufacturing processes, including mechanical, chemical and thermal processes. 
 Welding, joining and assembly at micro and macro scales. 
 Rapid prototyping, rapid manufacturing and repair, stereolithography and other 3-D fabrication techniques that can use optical projection. 
 Advanced embossing, casting, forming and molding processes at all scales. 
 Continuum and subcontinuum process modeling and simulation. 
 Manufacturing process monitoring, control and automation. 
 Tribology and wear issues relevant to manufacturing processes. 

收录体裁
original technical papers 
投稿指南 https://www.elsevier.com/journals/journal-of-manufacturing-processes/1526-6125/guide-for-authors#txt2001
投稿模板
参考文献格式 https://www.elsevier.com/journals/journal-of-manufacturing-processes/1526-6125/guide-for-authors#txt2001
编辑信息
Editor-in-Chief
University of Illinois at Urbana-Champaign, Champaign, Illinois, United States 
Associate Editors
M. Annoni, MSME
Polytechnic University of Milan, Milano, Italy

G. Cheng

Purdue University, West Lafayette, Indiana, United States
University of Louisville, Louisville, Kentucky, United States

H. Chung

Michigan State University, East Lansing, Michigan, United States

J. Dong

North Carolina State University, Raleigh, North Carolina, United States

A. Elwany

Texas A&M University College Station, College Station, Texas, United States

P. Guo

Northwestern University, Evanston, Illinois, United States

M. B. Jun

Purdue University, West Lafayette, Indiana, United States

A.S Kumar

National University of Singapore, Singapore, Singapore
Pennsylvania State University, University Park, Pennsylvania, United States

J. Ma

Saint Louis University, Saint Louis, Missouri, United States

A.S. Malik

University of Texas at Dallas, Richardson, Texas, United States

C. Nath

Hitachi Automotive Systems Americas Inc, Farmington Hills, Michigan, United States

G. Ngaile

North Carolina State University, Raleigh, North Carolina, United States

C. Nikhare

The Pennsylvania State University Erie The Behrend College, Erie, Pennsylvania, United States

S.S. Park

University of Calgary, Calgary, Alberta, Canada

J. Samuel

Rensselaer Polytechnic Institute, Troy, New York, United States

M. Strano

Polytechnic University of Milan, Milano, Italy

M. Sundaram

University of Cincinnati, Cincinnati, Ohio, United States
Technical University of Denmark Department of Mechanical Engineering, Kongens Lyngby, Denmark

B. Wu

Purdue University, West Lafayette, Indiana, United States

H. Yamaguchi Greenslet

University of Florida, Gainesville, Florida, United States

F. Yang

University of Kentucky, Lexington, Kentucky, United States

Y. Zhang

University of Kentucky, Lexington, Kentucky, United States


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