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Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).
Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systemsare also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.
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编辑信息 |
Editor-in-Chief L. JozwiakUniversity of Technology Eindhoven Department of Electrical Engineering, Postbus 513, 5600 MB, Eindhoven, Netherlands Email L. JozwiakHandling Editors M. BerekovicUniversity of Laubeck Department of Computer Engineering, Lübeck, GermanyO. BoncaloPolitehnica University of Timisoara, Timisoara, RomaniaM. ChangIowa State University, Ames, Iowa, United StatesW. ChangUniversity of York, York, United KingdomA. CilardoUniversity of Naples Federico II, Napoli, ItalyV. CirianiUniversity of Milan, Department of Computer Science, Milan, ItalyM. DaneshtalabRoyal Institute of Technology Kista, Kista, SwedenP. EllerveeTallinn University of Technology, Tallinn, EstoniaJ.C. FerreiraUniversity of Porto, Porto, PortugalK. GajGeorge Mason University, Fairfax, Virginia, United StatesM. GeilenUniversity of Technology Eindhoven, Eindhoven, NetherlandsD. GoswamiUniversity of Technology Eindhoven, Eindhoven, NetherlandsB. JuurlinkTechnical University of Berlin, Berlin, GermanyP. KitsosUniversity of the Peloponnese, Tripoli, GreeceH. KubátováCzech Technical University in Prague, Praha, Czech RepublicF. LeporatiUniversity of Pavia, Pavia, ItalyN. NedjahRio de Janeiro State University, RIO DE JANEIRO, BrazilS. NiarPolytechnic University Hauts-de-France, Valenciennes, FranceM. NovotnyCzech Technical University in Prague, Praha, Czech RepublicA. NúñezUniversity of Las Palmas de Gran Canaria, Gran Canaria, Canary Islands, SpainJ. NurmiTampere University Faculty of Information Technology and Communication Sciences, Tampere, FinlandM. O'NilsMid Sweden University, Sundsvall, SwedenF. OrphanoudakisHellenic Open University Schools of Science & Technology, Patra, GreeceG. PelosiPolytechnic University of Milan, Milano, ItalyL. PengLouisiana State University, Baton Rouge, Louisiana, United StatesT. PionteckUniversity of Lubeck, Ratzeburger Allee 160, 23562, Lübeck, GermanyA. PostulaUniversity of Queensland, Brisbane, Queensland, AustraliaH. PourshaghaghiRadboud University, Nijmegen, NetherlandsM. ShafiqueTU Wien University, Wien, AustriaN. SklavosUniversity of Patras, Patras, GreeceC. UribeNational Institute of Optical Astrophysics and Electronics, Puebla, MexicoM.N. VelevAries Design Automation LLC, Chicago, Illinois, United StatesE. VillarUniversity of Cantabria, Santander, SpainC. WangUniversity of Science and Technology of China School of Computer Science and Technology, Suzhou, China
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