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MICROPROCESSORS AND MICROSYSTEMS
基本信息
期刊名称 MICROPROCESSORS AND MICROSYSTEMS
MICROPROCESS MICROSY
期刊ISSN 0141-9331
期刊官方网站 http://www.journals.elsevier.com/microprocessors-and-microsystems/
是否OA
出版商 Elsevier
出版周期 Bimonthly
始发年份 1978
年文章数 105
最新影响因子 2.6(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术4区 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE 计算机:硬件4区
COMPUTER SCIENCE, THEORY & METHODS 计算机:理论方法4区
ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气4区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 1.44 0.264 0.897
Computer Science
Hardware and Architecture
89 / 152 41%
Computer Science
Artificial Intelligence
111 / 189 41%
Computer Science
Computer Networks and Communications
143 / 274 47%
Computer Science
Software
219 / 360 39%
补充信息
自引率 7.90%
H-index 33
SCI收录状况 Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0141-9331%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/micpro/tempdown.asp
收稿范围

Microprocessors and Microsystems: Embedded Hardware Design (MICPRO) is a journal covering all design and architectural aspects related to embedded systems hardware. This includes different embedded system hardware platforms ranging from custom hardware via reconfigurable systems and application specific processors to general purpose embedded processors. Special emphasis is put on novel complex embedded architectures, such as systems on chip (SoC), systems on a programmable/reconfigurable chip (SoPC) and multi-processor systems on a chip (MPSoC), as well as, their memory and communication methods and structures, such as network-on-chip (NoC).

Design automation of such systems including methodologies, techniques, flows and tools for their design, as well as, novel designs of hardware components fall within the scope of this journal. Novel cyber-physical applications that use embedded systemsare also central in this journal. While software is not in the main focus of this journal, methods of hardware/software co-design, as well as, application restructuring and mapping to embedded hardware platforms, that consider interplay between software and hardware components with emphasis on hardware, are also in the journal scope.

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Original research articles
Review articles
Note
投稿指南 https://www.elsevier.com/journals/microprocessors-and-microsystems/0141-9331/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/microprocessors-and-microsystems/0141-9331/guide-for-authors
编辑信息
Editor-in-Chief

L. Jozwiak

University of Technology Eindhoven Department of Electrical Engineering, Postbus 513, 5600 MB, Eindhoven, Netherlands 
Handling Editors

M. Berekovic

University of Laubeck Department of Computer Engineering, Lübeck, Germany

O. Boncalo

Politehnica University of Timisoara, Timisoara, Romania

M. Chang

Iowa State University, Ames, Iowa, United States

W. Chang

University of York, York, United Kingdom

A. Cilardo

University of Naples Federico II, Napoli, Italy

V. Ciriani

University of Milan, Department of Computer Science, Milan, Italy

M. Daneshtalab

Royal Institute of Technology Kista, Kista, Sweden

P. Ellervee

Tallinn University of Technology, Tallinn, Estonia

J.C. Ferreira

University of Porto, Porto, Portugal

K. Gaj

George Mason University, Fairfax, Virginia, United States

M. Geilen

University of Technology Eindhoven, Eindhoven, Netherlands

D. Goswami

University of Technology Eindhoven, Eindhoven, Netherlands

B. Juurlink

Technical University of Berlin, Berlin, Germany

P. Kitsos

University of the Peloponnese, Tripoli, Greece

H. Kubátová

Czech Technical University in Prague, Praha, Czech Republic

F. Leporati

University of Pavia, Pavia, Italy

N. Nedjah

Rio de Janeiro State University, RIO DE JANEIRO, Brazil

S. Niar

Polytechnic University Hauts-de-France, Valenciennes, France

M. Novotny

Czech Technical University in Prague, Praha, Czech Republic

A. Núñez

University of Las Palmas de Gran Canaria, Gran Canaria, Canary Islands, Spain

J. Nurmi

Tampere University Faculty of Information Technology and Communication Sciences, Tampere, Finland

M. O'Nils

Mid Sweden University, Sundsvall, Sweden

F. Orphanoudakis

Hellenic Open University Schools of Science & Technology, Patra, Greece

G. Pelosi

Polytechnic University of Milan, Milano, Italy

L. Peng

Louisiana State University, Baton Rouge, Louisiana, United States

T. Pionteck

University of Lubeck, Ratzeburger Allee 160, 23562, Lübeck, Germany

A. Postula

University of Queensland, Brisbane, Queensland, Australia

H. Pourshaghaghi

Radboud University, Nijmegen, Netherlands

M. Shafique

TU Wien University, Wien, Austria

N. Sklavos

University of Patras, Patras, Greece

C. Uribe

National Institute of Optical Astrophysics and Electronics, Puebla, Mexico

M.N. Velev

Aries Design Automation LLC, Chicago, Illinois, United States

E. Villar

University of Cantabria, Santander, Spain

C. Wang

University of Science and Technology of China School of Computer Science and Technology, Suzhou, China


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