Submission to first decision: 70 days
Submission to acceptance: 201 days

Analog Integrated Circuits and Signal Processing is an archival peer reviewed journal dedicated to the design and application of analog, radio frequency (RF), and mixed signal integrated circuits (ICs) as well as signal processing circuits and systems. It features both new research results and tutorial views and reflects the large volume of cutting-edge research activity in the field today.
A partial list of topics includes analog and mixed signal interface circuits and systems; analog and RFIC design; data converters; active-RC, switched-capacitor, and continuous-time integrated filters; mixed analog/digital VLSI systems; systems on chip, wireless radio transceivers; clock and data recovery circuits; and high speed optoelectronic circuits and systems.
Explores the design and application of analog, radio frequency (RF), and mixed signal integrated circuits (ICs) as well as signal processing circuits and systems
Reflects the large volume of cutting-edge research activity in the field
Features both new research results and tutorial views
97% of authors who answered a survey reported that they would definitely publish or probably publish in the journal again

Editor-in-Chief:
Mohammed Ismail
Dept. of Electrical Engineering, The Ohio State University, Columbus, USA
Chung-Chi Hung
National Chiao Tung University, Hsinchu City, Taiwan
Piero Malcovati
University of Pavia, Italy
Mixed Signal Letters Editors:

Kazuyuki Wada, Toyohashi University of Technology, Japan; Yehia Massoud, WPI, USA
Editorial Board:
Mohammad Alhawari, Wayne State University; E. Alarcon, UPC, Spain; Jad Atallah, Notre Dame University, Lebanon; Sidharth Balasubramanian, Texas Instruments, USA; Sergio Bampi, UFRGS, Brazil; Hervé Barthelemy, Institut Charles Fabry (ICF), Marseille, France; Steven Bibyk, Ohio State University, USA; Sleiman Bou-Sleiman, Intel, USA; Rick Carley, Carnegie Mellon University, USA; Hsin-Shu Chen, National Taiwan University, Taiwan; Ke-Horng Chen, National Chiao Tung University, Taiwan; Wei-Zen Chen, National Chiao Tung University, Taiwan; Yoon-Kyung Choi, Samsung Electronics, Korea; Mitra Mirhassani, University of Windsor, Canada; Rocio del Rio, University of Seville, Spain; Jose de la Rosa, University of Seville, Spain; Ayman Fayed, Ohio State University, USA; Eby G. Friedman, University of Rochester, NY, USA; Randall Geiger, Iowa State University, USA; Georges Gielen, ESAT-MICAS, Belgium; Ping Gui, Southern Methodist University, USA; Kari Halonen, Helsinki University of Technology, Finland; Mona Hella, RPI, USA; Sorin Huss, Technical University of Darmstadt, Germany; Tetsuro Itakura, Toshiba Corp., Japan; Jaeha Kim, Seoul National University, Korea; Tor Sverre Lande, University of Oslo, Norway; Yong Lian, National University of Singapore, Singapore; Tien-Yu Lo, MediaTek Inc., Taiwan; Franco Maloberti, University of Pavia, Italy; Jean-Yves Michel, Centillium Communications, France; Kong-Pang Pun, Chinese University of Hong Kong, Hong Kong, China; Susana Paton, Carlos III University, Spain; Costas Psychalinos, University of Patras, Greece; Timo Rahkonen, University of Oulu, Finland; Jaime Ramirez-Angulo, New Mexico State University, USA; Peter Reynaert, KU-Leuven, Belgium; Gabriel Rincon-Mora, Georgia Tech, USA; Angel Rodríguez-Vázquez, Universidad de Sevilla, Spain; Mihai Sanduleanu, Masdar Institute, UAE; Takahide Sato, University of Yamanashi, Japan; Takeshi Shima, Kanagawa University, Japan; Henrik Sjoland, Lund University, Sweden; Ahmed M. Soliman, Cairo University, Egypt; M. Taher Abuelma'atti, KFUPM, Saudi Arabia; Shigetaka Takagi, Tokyo Institute of Technology, Japan; Gabor Temes, Oregon State University, USA; Hannu Tenhunen, Swedish Royal Institute of Technology, Sweden; Seng Pan U (Ben), University of Macau, Macau, China; Zhihua Wang, Tsinghua University, China; Chung-Yu Wu, National Chiao Tung University, Taiwan; Orly Yadid-Pecht, Ben-Gurion University, Israel; Jerald Yoo,National University of Singapore; Xiaoyang Zeng, Fudan University, China, Yann Deval, Bordeaux University, France.