Nanoscale and Microscale Thermophysical Engineering is a journal covering the basic science and engineering of nanoscale and microscale energy and mass transport, conversion, and storage processes. In addition, the journal addresses the uses of these principles for device and system applications in the fields of energy, environment, information, medicine, and transportation.
The journal publishes both original research articles and reviews of historical accounts, latest progresses, and future directions in this rapidly advancing field. Papers deal with such topics as:
transport and interactions of electrons, phonons, photons, and spins in solids
interfacial energy transport and phase change processes
microscale and nanoscale fluid and mass transport and chemical reaction
molecular-level energy transport, storage, conversion, reaction, and phase transition
near field thermal radiation and plasmonic effects
ultrafast and high spatial resolution measurements
multi length and time scale modeling and computations
processing of nanostructured materials, including composites
micro and nanoscale manufacturing
energy conversion and storage devices and systems
thermal management devices and systems
microfluidic and nanofluidic devices and systems
molecular analysis devices and systems
Submissions are made online via ScholarOne Manuscripts. All submitted manuscripts are subject to initial appraisal by the Editor, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. In 2015, the average time for a manuscript to receive a first and final decision was 24 and 38 days, respectively, and the acceptance rate was 19%. Accepted manuscripts are posted online prior to copyediting via the Accepted Manuscripts Online (AMO) publication method. Print issues are published quarterly.

Founding Editor:
 
Professor C.L. Tien 
University of California at Berkeley

Editor-in-Chief: 

Dr. Li Shi
Department of Mechanical Engineering
The University of Texas at Austin
204 E. Dean Keeton St. Stop C2200 
Austin, TX 78712-0292 

Former Editors-in-Chief: 

Professor C.L. Tien - University of California at Berkeley 
Professor Arunava Majumdar - Stanford University
Professor Kenneth E. Goodson - Stanford University
 
Editors:
 
David Cahill - University of Illinois at Urbana-Champaign, Urbana, IL, USA 
Gian Piero Celata - ENEA National Institute of Thermal-Fluid Dynamics, Rome, ITALY 
Gang Chen - Massachusetts Institute of Technology, Cambridge, MA, USA 
Hsin-Chen Chu - ITRI, Hsinchu, TAIWAN
Andrei G. Fedorov -  Georgia Institute of Technology, GA, USA
Jean-Jacques Greffet - Institut Universitaire de France, Paris, FRANCE 
Shigeki Hirasawa - Kobe University, Kobe, JAPAN 
Massoud Kaviany - University of Michigan, Ann Arbor, MI, USA 
Joon Sik Lee - Seoul National University, Seoul, SOUTH KOREA 
Xin-gang Liang - Tsinghua University, Beijing, CHINA 
Jonathan A. Malen - Carnegie Mellon University, Pittsburgh, PA, USA 
Shigeo Maruyama - University of Tokyo, Tokyo, JAPAN 
Pamela Norris - University of Virginia, Charlottesville, VA, USA 
Yoav Peles - University of Central Florida, Orlando, FL, USA 
G.P. "Bud" Peterson - Georgia Institute of Technology, Atlanta, GA, USA 
Dimos Poulikakos - ETH, Zurich, SWITZERLAND 
Ravi Prasher - Lawrence Berkeley National Laboratory, Berkeley, CA, USA 
Pramod Reddy - University of Michigan, Ann Arbor, MI, USA 
Thomas Thundat - University of Alberta Edmonton, Alberta, CANADA 
Sebastian Volz - Centre National de la Recherche Scientifique (CNRS), CentraleSupélec, Université Paris-Saclay, Paris, FRANCE 
Evelyn Wang - Massachusetts Institute of Technology, Cambridge, MA, USA 
Akira Yabe - Research Center for Advanced Manufacturing on Nanoscale Science and Engineering, AIST, 1-2-1, Namiki, Tsukuba Science City, Ibaraki, JAPAN 305-8564
Xing Zhang - Tsinghua University, Beijing, China

Editorial Advisory Board:
 
Richard O. Buckius - Purdue University, West Lafayette, IN, USA
Markus I. Flik - HOMAG Group AG, Schopfloch, GERMANY 
Kaigham Gabriel - Motorola Mobility, LLC, Libertyville, IL, USA 
Suresh V. Garimella - Purdue University, West Lafayette, IN, USA 
Zeng-Yuan Guo - Tsinghua University, Beijing, CHINA 
Shigeki Hirasawa - Hitachi, Ltd., Ibaraki, JAPAN 
Frank P. Incropera - University of Notre Dame, South Bend, IN, USA 
Alexander Ivanovich Leontiev - Russian Academy of Sciences, Moscow, RUSSIA 
Toshiro Makino - Kyoto University, Kyoto, JAPAN 
Akiro Nagashima - Keio University, Tokyo, JAPAN 
Vishwanath Prasad - University of North Texas, Denton, TX, USA