当前位置: X-MOL首页最新SCI期刊查询及投稿分析系统 › MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING杂志
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
基本信息
期刊名称 MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
MAT SCI SEMICON PROC
期刊ISSN 1369-8001
期刊官方网站 http://www.elsevier.com/wps/find/journaldescription.cws_home/600849/description#description
是否OA
出版商 Elsevier Ltd
出版周期 Bimonthly
始发年份
年文章数 412
最新影响因子 4.1(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术3区 ENGINEERING, ELECTRICAL & ELECTRONIC 工程:电子与电气3区
MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区
PHYSICS, APPLIED 物理:应用3区
PHYSICS, CONDENSED MATTER 物理:凝聚态物理3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 2.83 0.633 1.063
Engineering
Mechanics of Materials
77 / 352 78%
Physics and Astronomy
Condensed Matter Physics
84 / 397 78%
Engineering
Industrial and Manufacturing Engineering
104 / 579 82%
Materials Science
General Materials Science
115 / 439 73%
补充信息
自引率 7.30%
H-index 43
SCI收录状况 Science Citation Index
Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=1369-8001%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/mssp/
收稿范围

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. 
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronicsenergyconversion and storage, communicationsbiotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materialschemical processingvapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. 
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

收录体裁
Original research papers, reviews, letters to the editor.
投稿指南 https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/materials-science-in-semiconductor-processing/1369-8001/guide-for-authors
编辑信息
Editor in Chief
Professor Steven M. Durbin
Western Michigan University, United States
Editors

Professor Kuan Yew Cheong

Universiti Sains Malaysia School of Materials and Mineral Resources Engineering, Malaysia

Dr. Aracely Hernández Ramírez

Autonomous University of Nuevo Leon Faculty of Chemical Sciences, Mexico

Professor Masaya Ichimura

Nagoya Institute of Technology, Japan

Dr. Giuliana Impellizzeri

National Research Council, Italy

Dr. Jon Major

University of Liverpool, United Kingdom

Prof. Dr. Andre Schleife, PhD

University of Illinois at Urbana-Champaign Department of Materials Science and Engineering, United States Electronic structure, first principles, theoretical spectroscopy, femto-second electron dynamics 
Associate Editor
The University of Texas at El Paso Department of Electrical and Computer Engineering, El Paso, Texas, United States photovoltaics, perovskites, CZT radiation detector material
Chair of the International Editorial Board

Dr. Aloysius F. Hepp, Editor-in-Chief Emeritus

NASA John H Glenn Research Center, United States
Special Issues Editor
International Editorial Board

Professor M.S. Aida

University of Constantine 1, Algeria

Dr. James Aldous

University of Cambridge, United Kingdom

Professor Delaina A. Amos

University of Louisville, United States

Dr. Annick Anctil

Michigan State University, United States

Dr. Christopher Bailey

Old Dominion University, United States

Dr. Andrew R. Barron

Rice University, United States

Professor Kanisha Biswas

Jawaharlal Nehru Centre for Advanced Scientific Research, India

Dr. Hartmut Bracht

University of Münster, Germany

Dr. Xian-An (Andrew) Cao

West Virginia University, United States

Dr. L.S. Cavalcante

State University of Piaui Natural Sciences Centre, Brazil

Dr. M.V.S. Chandrashekhar

University of South Carolina, United States

Professor Albert Chawanda

Midlands State University, Zimbabwe

Professor Lung-Chien Chen

National Taipei University of Technology, Taiwan

Dr. Russell R. Chianelli

University of Texas at El Paso, United States

Professor Oana Cojocaru-Mirédin

Max Planck Institute for Iron Research GmbH, Germany

Professor Ana Cros Stötter

University of Valencia, Spain

Professor Carl Cui

The University of Sydney, Australia

Dr. Mmantsae Diale

University of Pretoria Department of Physics, South Africa

Dr. Ray Duffy

University College Cork National University of Ireland, Ireland

Professor Ken Durose

University of Liverpool, United Kingdom

Professor Moshe Eizenberg

Technion Israel Institute of Technology, Israel

Professor Ayse Erol

Istanbul University, Turkey

Professor Mark Fink

Tulane University, United States

Dr. Dennis J. Flood

Natcore Technology, United States

Dr. Mariana Amorim Fraga

Technological Institute of Aviation, Brazil

Dr. Alex Freundlich

University of Houston, United States

Dr. Karol Fröhlich

Slovak Academy of Sciences, Slovakia

Professor Louis J. Guido

Virginia Tech University Bookstore, United States

Professor Parameswar Hari

The University of Tulsa, United States

Prof. Dr. Zsolt Horvath

Hungarian Academy of Sciences, Hungary

Professor W. Chris Hughes

James Madison University, United States

Professor Masaya Ichimura

Nagoya Institute of Technology, Japan

Dr. Michael Jin

Johns Hopkins University Applied Physics Laboratory Information Group, United States

Dr. Richard Paul Owen Jones

Anglia Ruskin University Global Sustainability Institute, United Kingdom

Dr. Satoshi Kaneco

Mie University Graduate School of Engineering Faculty of Engineering Department of Chemistry for Materials, Japan

Professor Zhenhui Kang

Soochow University, China

Dr. Manish Keswani

University of Arizona, United States

Professor Malle Krunks

Tallinn University of Technology, Estonia

Professor Clifford P. Kubiak

University of California San Diego Department of Chemistry and Biochemistry, United States

Professor Prashant N. Kumta

University of Pittsburgh, United States

Dr. Marian Lehocky

Tomas Bata University in Zlin, Czech Republic

Professor Markku Leskalä

University of Helsinki, Finland

Professor Xiuling Li

University of Illinois at Urbana-Champaign, United States

Professor Oleg Lupan

Technical University of Moldova, Moldova

Dr. Tae Young Ma

Gyeongsang National University, The Republic of Korea

Dr. Jeffrey Maranchi

Johns Hopkins University Applied Physics Laboratory Information Group, United States

Dr. Ricardo Marotti Priero

University of the Republic Uruguay, Uruguay

Professor Miguel Angel Meléndez-Lira

Center for Research and Advanced Studies of the National Polytechnic Institute Physics Department, Mexico

Dr. Enrico Napolitani

University of Padua, Italy

Dr. Michael Nolan

University College Cork National University of Ireland, Ireland

Dr. Jozef Novák

Slovak Academy of Sciences, Slovakia

Dr. Nurxat Nuraje

TEXAS TECH UNIVERSITY, United States

Dr. Michael Osofsky

US Naval Research Laboratory, United States

Dr. Jozef Osvald

Slovak Academy of Sciences, Slovakia

Dr. Hyunwoong Park

Kyungpook National University, The Republic of Korea

Dr. Albena Paskaleva

Bulgarian Academy of Sciences, Bulgaria

Dr. Sebastian Patzig-Klein

RENA Technologies GmbH Solar Technologie Center Freiburg, Germany

Dr. Ioannis Poulios

Aristotle University of Thessaloniki, Greece

Dr. Aswini Pradhan

Norfolk State University, United States

Dr. Peter Psarras

Stanford University, United States

Dr. Ryne Raffaelle

Rochester Institute of Technology, United States

Dr. Manoj Kumar Ram

University of South Florida, United States

Dr. Thomas Riedl

University of Wuppertal, Germany

Professor Judy Rorison

University of Bristol, United Kingdom

Professor Mehmet Sahiner

Seton Hall University, United States

Dr. David Schiraldi

Case Western Reserve University, United States

Dr. Azzouz Sellai

Sultan Qaboos University, Oman

Dr. Tejinder Singh

Intel Corp Hawthorn Farm, United States

Professor Elias Stathatos

University of the Peloponnese Department of Electrical and Computer Engineering, Greece

Dr. Rajagopalan Thiruvengadathan

Amrita Vishwa Vidyapeetham, India

Dr. Joanna Trojan-Piegza

Wroclaw University of Science and Technology, Poland

Dr. Abdulmecit Türüt

Istanbul Medeniyet University, Turkey

Dr. Subramaniam Velumani

Center for Research and Advanced Studies of the National Polytechnic Institute, MexicoTel :+52 (55) 5747 4001(Dir) & sec 4002 Fax :+52 (55) 5747 4003 1. Velumani Subramaniam PhD velu@cinvestav.mx Coordinador de Relaciones Internacionales y Profesor Investigador en Ingenieria Electrica(SEES), Centro de Investigacion y de Estudios Avanzados del I.P.N.(CINVESTAV), Av. Instituto Politecnico Nacional # 2508 Col. San Pedro Zacatenco 07360, Mexico D.F. Tel :+52 (55) 5747 4001(Dir) & sec 4002 Fax :+52 (55) 5747 4003 http://cori.cinvestav.mx/Velumani

Dr. Purakh Raj Verma

GlobalFoundries Inc Sunnyvale, United States

Professor James Williams

Australian National University, Australia

Professor Maggie Xia

The University of British Columbia, Canada

Dr. Lidong Zhao

Beihang University, China

Dr. Tsvetanka Zheleva

US Army Research Laboratory, United States

Dr. Rongkun Zheng

The University of Sydney, Australia


我要分享  (欢迎您来完善期刊的资料,分享您的实际投稿经验)
研究领域:
投稿录用情况: 审稿时间:  个月返回审稿结果
本次投稿点评:
提交
down
wechat
bug