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JOURNAL OF MATERIALS SCIENCE
基本信息
期刊名称 JOURNAL OF MATERIALS SCIENCE
J MATER SCI
期刊ISSN 0022-2461
期刊官方网站 https://www.springer.com/journal/10853
是否OA 混合
出版商 Springer Nature
出版周期 月刊
始发年份 1966
年文章数 1306
最新影响因子 4.5(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
工程技术2区 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科学:综合3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 3.31 0.823 1.065
Engineering
Mechanics of Materials
57 / 352 83%
Engineering
Industrial and Manufacturing Engineering
75 / 579 87%
Materials Science
General Materials Science
93 / 439 78%
补充信息
自引率 8.40%
H-index 135
SCI收录状况 Science Citation Index
Science Citation Index Expanded
官方审稿时间
19days
Submission to first decision
90days
Submission to acceptance
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0022-2461%5BISSN%5D
投稿指南
期刊投稿网址 https://www.editorialmanager.com/jmsc/default.aspx
收稿范围

有关材料的结构,特性和用途之间的关系的原始研究结果或研究技术。 接收广泛材料领域的研究,材料包括金属,陶瓷,玻璃,聚合物,能源材料,电气材料,复合材料,纤维,纳米结构材料,纳米复合材料以及生物和生物医学材料。

The Journal of Materials Science is now firmly established as the leading source of primary communication for scientists investigating the structure and properties of all engineering materials. The Journal of Materials Science publishes reviews and full-length papers recording original research results on, or techniques for, studying the relationship between structure, properties, and uses of materials. Materials include metals, ceramics, glasses, polymers, energy materials, electrical materials, composite materials, fibers, nanostructured materials, nanocomposites, and biological and biomedical materials.

收录体裁
综述论文和特刊合作组建
投稿指南 https://www.springer.com/journal/10853/submission-guidelines
投稿模板
参考文献格式
编辑信息

Editor-in-Chief:

C. Barry Carter
University of Connecticut
Storrs, CT, USA

Deputy Editors-in-Chief:

Christopher F. Blanford
The University of Manchester, Manchester, UK

M. Grant Norton
Washington State University, Pullman, WA, USA

Editors:

Antonia Antoniou
Georgia Institute of Technology, Atlanta, GA, USA

Mark Bissett
The University of Manchester, Manchester, UK

Kyle S. Brinkman
Clemson University, Clemson, SC, USA

Pedro Camargo
University of Helsinki, Helsinki, Finland

David P. Cann
Oregon State University, Corvallis, OR, USA

Chris Cornelius
University of Nebraska, Lincoln, NE, USA

João Quinta da Fonseca
The University of Manchester, Manchester, UK

Shen Dillon
University of Illinois at Urbana-Champaign, Urbana, IL, USA

Avinash Dongare
University of Connecticut, Storrs, CT, USA

Stephen J. Eichhorn
University of Bristol, Bristol, UK

Jaime Grunlan
Texas A&M, College Station, TX, USA

Dale L. Huber
Sandia National Laboratories, Albuquerque, NM, USA

Maude Jimenez
Université Lille 1, Villeneuve d'Ascq, France

Kevin Jones
University of Florida, Gainesville, FL, USA

Nathan A. Mara
University of Minnesota, Minneapolis, MN, USA

Philip Nash
Illinois Institute of Technology, Chicago, IL, USA

Corinne E. Packard
Colorado School of Mines, Golden, CO, USA

Sophie Primig
University of South Wales, Sydney, Australia

N. Ravishankar
Indian Institute of Science, Bangalore, India

Greg Rutledge
MIT, Cambridge, MA, USA

Annela M. Seddon
Bristol University, Bristol, UK

Yujie Xiong
USTC, Hefei, China

Yaroslava Yingling
North Carolina State University, Raleigh, NC, USA

Naiqin Zhao
Tianjin University, Tianjin, China

Invited Reviews Editors:

Philip Nash
Illinois Institute of Technology, Chicago, IL, USA

Editorial Board:

A.K. Bhowmick,Indian Institute of Technology, Kharagpur, India; A. Boccaccini, University of Erlangen-Nuremberg, Germany;D. Chatain, CNRS, Marseilles, France;K. Chawla,University of Alabama atBirmingham, USA; R.F. Cook, National Institute of Standards and Technology, Gaithersburg, MD; D.Dimos,The University of Texas Arlington, USA; E. Eustathopolous, CNRS, Grenoble, France;R. W.Grimes,Imperial College, London, UK; Y. Ikuhara, University of Tokyo, JFCC-Nagoya, and Tohoku University, Japan;W.D. Kaplan, Technion-Israel Institute of Technology, Haifa, Israel; H.S. Kim, POSTECH, Pohang, South Korea; K. Krishnan,University ofWashington, Seattle, USA; T.G. Langdon,University ofSouthampton, UK; Y-W Mai, The University of Sydney, Australia; A. Passerone, CNR, Genova, Italy;E. Rabkin,Technion- Israel Institute of Technology,Haifa, Israel; H. Saka, Nagoya University, Japan; G. Solórzano, Pontificia Universidade Católica (PUC) Rio de Janeiro, Brazil; A.C. Taylor, Imperial College, London, UK; Z.L. Wang,Georgia Institute of Technology,Atlanta, USA;Y.T. Zhu, North Carolina State University, Raleigh, NC, USA

Distinguished Advisory Board:

R. Abbaschian, University of California, Riverside, CA, USA; W. Bonfield, (Chairman) University of Cambridge, UK; E. Baer,Case Western Reserve University, Cleveland, OH, USA;W. C. Carter, Massachusetts Institute of Technology, Cambridge, MA, USA; K. Chattopadhyay, Indian Institute of Science, Bangalore, India; G. Eggeler, Institut fur Werkstoffe, Bochum, Germany; J. H. Evans-Freeman, University of Canterbury, Canterbury, NZ; L.C.Feldman,Rutgers University, Piscataway, NJ, USA; D. Fray,University of Cambridge, UK; K. Friedrich,Kaiserslautern University,Germany; C.M. Hansson,University of Waterloo, ON, Canada; Z. Munir, University of California, Davis, CA;T.F. Page, University of Newcastle upon Tyne, UK;R. O. Ritchie, University of California, Berkeley, CA, USA; C. Russel, Friedrich-Schiller-University, Jena, Germany;A.P. Tomsia, Lawrence Berkeley National Laboratory, Berkeley, CA, USA; A.F.W.Willoughby, University of Southampton, UK; Robert J. Young, The University of Manchester, UK


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