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JOURNAL OF COLLOID AND INTERFACE SCIENCE
基本信息
期刊名称 JOURNAL OF COLLOID AND INTERFACE SCIENCE
J COLLOID INTERF SCI
期刊ISSN 0021-9797
期刊官方网站 http://www.elsevier.com/wps/find/journaldescription.cws_home/622861/description#description
是否OA
出版商 Academic Press Inc.
出版周期 Semimonthly
始发年份 1966
年文章数 1237
最新影响因子 9.9(2022)  scijournal影响因子  greensci影响因子
中科院SCI期刊分区
大类学科 小类学科 Top 综述
化学2区 CHEMISTRY, PHYSICAL 物理化学3区
CiteScore
CiteScore排名 CiteScore SJR SNIP
学科 排名 百分位 5.93 1.290 1.322
Chemical Engineering
Chemical Health and Safety
4 / 14 75%
Materials Science
Surfaces, Coatings and Films
9 / 116 92%
Materials Science
Biomaterials
9 / 83 89%
Materials Science
Electronic, Optical and Magnetic Materials
24 / 225 89%
补充信息
自引率 8.00%
H-index 209
SCI收录状况 Science Citation Index
Science Citation Index Expanded
官方审稿时间
网友分享审稿时间 数据统计中,敬请期待。
PubMed Central (PML) http://www.ncbi.nlm.nih.gov/nlmcatalog?term=0021-9797%5BISSN%5D
投稿指南
期刊投稿网址 http://ees.elsevier.com/jcis/
收稿范围

The Journal of Colloid and Interface Science publishes original research findings on fundamental principles of colloid and interface science, as well as conceptually novel applications of these in advanced materials, nanomedicine, energy, environmental technologies, catalysis, and related fields. Criteria for publication are impact, quality, novelty and originality.

The Journal of Colloid and Interface Science emphasizes fundamental scientific innovation within the following categories:

A. Colloidal Materials and Nanomaterials
B. Soft Colloidal and Self-Assembly Systems
C. AdsorptionCatalysis and Electrochemistry
D. Interfacial ProcessesCapillarity and Wetting
E. Biomaterials and Nanomedicine
F. Energy Conversion and Storage, and Environmental Technologies


收录体裁
original research articles and feature articles.
投稿指南 https://www.elsevier.com/journals/journal-of-colloid-and-interface-science/0021-9797/guide-for-authors
投稿模板
参考文献格式 https://www.elsevier.com/journals/journal-of-colloid-and-interface-science/0021-9797/guide-for-authors
编辑信息

Editor-in-Chief

M. Malmsten, PhD

University of Copenhagen Department of Pharmacy, København, Denmark

Email M. Malmsten, PhD

Managing Editor

A.T. Hubbard

Santa Barbara, CA, USA

Co-Editors

T.J. Bandosz, PhD, DSC

City University of New York, New York, New York, United States

Email T.J. Bandosz, PhD, DSC

D. Berti

University of Florence, Firenze, Italy

Email D. Berti

B. Boyd

Monash University, Clayton, Victoria, Australia

Email B. Boyd

J. Eastoe

University of Bristol, Bristol, United Kingdom

Email J. Eastoe

M.A. López-Quintela

University of Santiago de Compostela, Santiago de Compostela, Spain

Email M.A. López-Quintela

G.-Q.M. Lu

University of Surrey, Guildford, United Kingdom

Email G.-Q.M. Lu

S.-B. Wang

The University of Adelaide School of Chemical Engineering and Advanced Materials, Adelaide, South Australia, Australia

Email S.-B. Wang

G. Zheng

Fudan University, Shanghai, China

Email G. Zheng

Assistant Editor

P. Domínguez Ríos

University of Santiago de Compostela, Santiago de Compostela, Spain

Email P. Domínguez Ríos

L. Hong

Monash University Faculty of Pharmacy and Pharmaceutical Sciences, Parkville, Australia

Email L. Hong

W. Li

Saint Petersburg University, Sankt Peterburg, Russian Federation

Email W. Li

L. Liu

University of Surrey, Guildford, United Kingdom

Email L. Liu

M. Mamusa

University of Florence, Firenze, Italy

Email M. Mamusa

J. Tang

Fudan University, Shanghai, China

Email J. Tang

Advisory Board

Z. Adamczyk

Krakow, Poland

J. Arcibar-Orozco

Leon, Mexico

P. Baglioni

Firenze, Italy

A. Bhunia

Kolkata, India

B. Bhushan

Columbus, Ohio, United States

S. Biswal

Houston, Texas, United States

P. Chen

Singapore, Singapore

R. Dagastine

Parkville, Victoria, Australia

J. L. Delgado

Donostia-San Sebastian, Spain

E. Deliyanni

Thessaloniki, Greece

Y.H. Deng

Shanghai, China

J. Dey

Kharagpur, India

J. Dong

Wuhan, China

P. Dowding

Abingdon, United Kingdom

C.A. Dreiss

London, United Kingdom

Y. Du

Suzhou, China

G. D’Errico

Napoli, Italy

K. Edler

Bath, United Kingdom

Y. Feng

Chengdu, Sichuan, China

A.F. Fery

Dresden, Germany

M. Florent

New York, New York, United States

M. Fu

Xiamen, China

V.M. Gun'ko

Kiev, Ukraine

G. Ji

Nanjing, China

K.P. Johnston

Austin, Texas, United States

P.V. Kamat

Notre Dame, Indiana, United States

M. Kruk

New York, New York, United States

J.B. Li

Beijing, China

J. Lützenkirchen

Karlsruhe, Germany

O. Manor

Haifa, Israel

D.J. McClements

Amherst, Massachusetts, United States

L.K. Pan

Shanghai, China

W. Parak

Hamburg, Germany

D. Petsev

Albuquerque, New Mexico, United States

M. Rutland

Stockholm, Sweden

J.-M. Ruysschaert

Bruxelles, Belgium

Saravanakumar

B.-L. Su

Namur, Belgium

R.F. Tabor

Clayton, Victoria, Australia

P. Tartaj

Madrid, Spain

R.D. Tilton

Pittsburgh, Pennsylvania, United States

I. Tucker

Wirral, United Kingdom

W. de Vos

Enschede, Netherlands

J. Walz

Milwaukee, Wisconsin, United States

M. Wang

Beijing, China

E.J. Wanless

C. Whitby

Palmerston North, New Zealand

D.Q. Wu

Shanghai, China

X. Yan

Shanghai, China

B. Yang

Changchun, China

M. Yates

Rochester, New York, United States

D. Y. Zhao

Shanghai, China

Editor Emeritus

D.T. Wasan

Chicago, Illinois, United States

Past Editors

V.K. La Mer

Editor, 1946 - 1965

A.C. Zettlemoyer

Co-Editor, 1965 - 1987

M. Kerker

Co-Editor, 1965 - 1987: Editor, 1987 - 1992

J.P. Kratohvil

Co-Editor, 1987 - 2004

H. Kunieda‡

Co-Editor, 2004 - 2005

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