Strengthened conductive shielded graphene/nano-Cu/crosslinking polyurethane (CPU) foam with ultrahigh interfacial functions was newly fabricated, involving the use of nano-assembly-freeze extraction route. The 3D supported modified graphene-nano-Cu (GC) interface were analyzed and verified efficiently by FTIR, XRD, XPS spectra and SEM, TEM images. Towards the CPU foams doped with GC network, surface polarity was weakened efficiently, and the anti-permeation efficiency was significantly improved due to the special positive piling behaviors of nanosheets. The initial decomposition temperature (enhanced by ∼22.2%) was efficiently delayed on account of heat transfer and doping protection. Thermal conductivity consistently fitted with modified Maxwell-Garnett method (D ∼ 5, K_p/Km ∼ 1000) was increased by ∼338% due to the collaborative formation of phonon-electron transmission network. More importantly, the electric conductivity was increased by orders of magnitude, along with the verification of 3D synergistic transmission network using percolation threshold. As compared to the pure CPU material, a maximum electromagnetic interference shielding (EMI) effectiveness of over 55 dB in the frequency range of 0–9 GHz was demonstrated on the interface with only ∼0.87 vol% GC doping. All these suggest that the CPU foams simply doped with characteristic GC possesses a great potential to be used as lightweight, highly conductive, anti-penetrative and stable anti-interference materials.

新型制备的具有超高界面功能的增强型导电屏蔽石墨烯/纳米铜/交联聚氨酯（CPU）泡沫，涉及使用纳米组装-冻结萃取路线。通过FTIR，XRD，XPS光谱以及SEM，TEM图像对3D支持的改性石墨烯-纳米铜（GC）界面进行了有效分析和验证。对于掺杂有GC网络的CPU泡沫，由于纳米片具有特殊的正堆积行为，表面极性被有效削弱，并且防渗透效率得到显着提高。由于传热和掺杂保护，初始分解温度（提高了约22.2％）被有效地延迟了。导热系数始终与改进的Maxwell-Garnett方法拟合（D〜5，K _p/ Km〜1000）由于声子-电子传输网络的共同形成而增加了〜338％。更重要的是，随着使用渗透阈值对3D协同传输网络的验证，电导率增加了几个数量级。与纯CPU材料相比，在0〜9 GHz的频率范围内，仅约0.87 vol％的GC掺杂在界面上显示出超过55 dB的最大电磁干扰屏蔽（EMI）效果。所有这些表明，简单地掺杂有特征GC的CPU泡沫具有巨大的潜力，可以用作轻质，高导电性，抗渗透性和稳定的抗干扰材料。