The aim of this study was to characterize low-shrinkage dental composites containing methacrylethyl-polyhedral oligomeric silsesquioxane (ME-POSS). Four experimental composites were manufactured, two of which contained organic matrixes of BisGMA-TEGDMA (70/30 wt% - BGC) and BisEMA-TEGDMA (80/20 wt% - BEC). The two other experimental composites replaced BisGMA and BisEMA with 25 wt% of ME-POSS (BGP and BEP). The composites also contained 70 wt% of 0.7 µm silanized BaBSi particles. The following properties were evaluated: Degree of conversion (DC%), volumetric polymerization shrinkage (VS%), polymerization shrinkage stress (Pss), flexural strength (FS), Flexural modulus (FM), hardness (KHN), water sorption (W_sp), water solubility (W_sl), diffusion coefficient (D), and wear. The DC% was not influenced by the presence of ME-POSS, with BEC (75.6%) and BEP (74.8%) presenting higher DC% than BGC (60.6%) and BGP (55.6%). The ME-POSS-containing composites (BGP and BEP) presented significantly lower VS% and Pss. The FS ranged from 92.7 to 142.0 MPa and the FM from 3.6 to 10.3 GPa. ME-POSS did not influence the KHN. BEC and BEP presented lower W_sp and W_sl when compared to BGC and BGP. D ranged from 1.0 × 10⁻⁶ to 7.4 × 10⁻⁶ cm² m⁻¹. Incorporation of ME-POSS significantly decreased the wear for both binary matrices (p < 0.05). With the exception of FS and FM for BGP, the incorporation of ME-POSS decreased the VS% and Pss without jeopardizing the other properties of the experimental dental composites.

这项研究的目的是表征包含甲基丙烯酸乙基多面体低聚倍半硅氧烷（ME-POSS）的低收缩牙科复合材料。制造了四个实验复合材料，其中两个包含BisGMA-TEGDMA（70/30 wt％-BEC）和BisEMA-TEGDMA（80/20 wt％-BEC）的有机基质。其他两个实验复合材料用25 wt％的ME-POSS（BGP和BEP）代替了BisGMA和BisEMA。该复合材料还包含70 wt％的0.7 µm硅烷化BaBSi颗粒。评估了以下性质：转化率（DC％），体积聚合收缩率（VS％），聚合收缩应力（Pss），弯曲强度（FS），弯曲模量（FM），硬度（KHN），吸水率（W _sp），水溶性（W _sl），扩散系数（D）和磨损。DC％不受ME-POSS的影响，BEC（75.6％）和BEP（74.8％）的DC％高于BGC（60.6％）和BGP（55.6％）。含ME-POSS的复合材料（BGP和BEP）呈现出较低的VS％和Pss。FS范围从92.7至142.0 MPa，FM范围从3.6至10.3 GPa。ME-POSS不会影响KHN。与BGC和BGP相比，BEC和BEP的W _sp和W _sl更低。D从1.0×10 ^-6到7.4×10 ^-6 cm ² m ^-1。ME-POSS的加入显着降低了两种二元矩阵的磨损（p <0.05）。除了用于BGP的FS和FM外，ME-POSS的加入降低了VS％和Pss，而没有损害实验性牙科复合材料的其他性能。