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Bonding of aluminum coated silicon wafers based on polypropylene carbonate and as a multi-functional sensor
Organic Electronics ( IF 3.2 ) Pub Date : 2018-10-02 , DOI: 10.1016/j.orgel.2018.09.050
Zhiyuan Zhu , Kequan Xia , Jiangmin Fu , Chaolin Du , Hongze Zhang , Haijun Lou , Zhiwei Xu

In this work, we propose an innovative low-temperature, low-pressure, and rapid aluminum (Al)-coated silicon wafer bonding process based on polypropylene carbonate (PPC). The integration of a multi-functional sensor and vertical interconnection for the Al-coated wafers was demonstrated via a cleanroom-free mechanism employing commercially available and affordable material. The proposed methodology offers a rapid and simple solution for Al-coated silicon bonding, and the possibility for fully realizing the potential of bonded wafers as a multi-functional sensor.



中文翻译:

结合基于聚碳酸亚丙酯并用作多功能传感器的铝涂层硅晶片

在这项工作中,我们提出了一种创新的低温,低压,快速的基于碳酸亚丙酯(PPC)的铝(Al)涂层的硅晶片键合工艺。通过无尘室机制,采用市场上可买到的可负担得起的材料,证明了多功能传感器和镀铝晶片垂直互连的集成。所提出的方法为铝涂层硅键合提供了一种快速而简单的解决方案,并有可能完全实现键合晶片作为多功能传感器的潜力。

更新日期:2018-10-02
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