In order to reduce the large residual stress in micro elelctroforming layer, megasonic assisted electroforming is proposed here. Micro electroforming experiments were performed with and without megasonic agitation, respectively. Four different megasonic power densities were applied to investigate the influence of megasonic agitation on reducing the residual stress. The residual stress was measured by X-ray diffraction (XRD) method. Experiment results show that the residual stresses fabricated with megasonic agitation are less than that fabricated without megasonic. When the megasonic power density is 2W/cm², the residual stress can be the minimum value of -125.7 MPa, reduced by 60% in comparison with the value of -315.1 MPa electroformed without megasonic agitation. For exploring the mechanism of megasonic agitation on reducing the residual stress, the dislocation density and crystal orientation were calculated by the single-line Voigt profile analysis and Relative Texture Coefficient (RTC) method, respectively. The diameters and distributions of pits on the surface of electroforming layer were observed by the STM-6 tool microscope and counted by the Image-Pro Plus software. It reveals that one hand of the mechanism is the acoustic streaming produced by megasonic can strengthen the motion of dislocation in crystal lattice and makes the crystal lattices grow towards the equilibrium shape, which is benefit to crystallization with low residual stress. When the megasonic power density is 2W/cm², the dislocation density increases to be the maximum value of 8.09×10¹⁵ m^-2 and the difference between RTC₍₁₁₁₎ and RTC₍₂₀₀₎ decreases to be zero, which is consistent with the residual stress results. The other hand is that the stable cavitation produced by megasonic can provide residual stress release points during the electroforming process.

为了减少微电铸层中较大的残余应力，在此提出了超音速辅助电铸。分别在有和没有超音速搅拌的情况下进行微电铸实验。应用了四种不同的超音速功率密度来研究超音速搅拌对降低残余应力的影响。残余应力通过X射线衍射（XRD）方法测量。实验结果表明，采用超音速搅拌所产生的残余应力要小于不采用超音速搅拌所产生的残余应力。当超音速功率密度为2W / cm ^2时，残余应力可以是最小值-125.7 MPa，与未经大声波搅拌电铸的-315.1 MPa的值相比降低了60％。为了探索大声波搅拌降低残余应力的机理，分别通过单线Voigt轮廓分析和相对织构系数（RTC）方法计算了位错密度和晶体取向。用STM-6工具显微镜观察电铸层表面凹坑的直径和分布，并用Image-Pro Plus软件计数。结果表明，机理的一方面是兆声波产生的声流可以增强晶格中位错的运动，并使晶格向平衡态生长，有利于低残余应力的晶化。^{如图2所示}，位错密度增大为最大值8.09×10 ¹⁵ m ^-2，并且RTC _（111）和RTC _（200）之间的差减小为零，这与残余应力结果一致。另一方面是，由兆声波产生的稳定的气穴现象可以在电铸过程中提供残余的应力释放点。