Copper is one of the most widely used materials in industrial applications, such as electric power, electronics, and mechanical engineering fields. However, under high humidity, high temperature environment, acid, base, and salt solutions, the copper is vulnerable to destruction, which induces the oxidation and corrosion of copper surface. For circumventing these problems, a robust hydrophobic hexagonal boron nitride nanosheets (BNNSs) coating is facilely prepared through integrating the methods of liquid exfoliation, interface self‐assembly, and physics vapor deposition. The coating can prevent the copper to be oxidized at temperature as high as 500 °C. The corrosive droplets on the coating surface keep in Cassie's state and cannot penetrate into the valley of the topography, which effectively prevents the electrochemical corrosion at the interface between copper and the coating materials even under the DC voltage of 10 V. This finding sheds light on large‐scale constructing of oxidation/corrosion‐resistant coating for copper base materials toward practical industrial application.

中文翻译：

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易于组装的大面积BNNSs膜，用于抗氧化/耐腐蚀涂层

铜是工业应用（例如电力，电子和机械工程领域）中使用最广泛的材料之一。然而，在高湿度，高温环境，酸，碱和盐溶液中，铜容易受到破坏，从而引起铜表面的氧化和腐蚀。为了解决这些问题，通过集成液体剥离，界面自组装和物理气相沉积方法，可以轻松地制备坚固的疏水性六方氮化硼六方氮化硼纳米片（BNNSs）。该涂层可以防止铜在高达500°C的温度下被氧化。涂层表面的腐蚀性液滴保持卡西状态，并且不能渗入地形谷，