A modular solder system with hierarchical morphology and micro/nanofeatures in which solder nanoparticles are distributed on the surface of template micropowders is reported. A core–shell structure of subsidiary nanostructures, which improved the intended properties of the modular solder is also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but also to impart other functions. By combining all of these, it is determined that the modular solder system is able to increase reflowability on a heat‐sensitive plastic substrate, oxidation resistance, and electrical conductivity. In this respect, the system could be readily modified by changing the structure and composition of each constituent and adopting backward compatibility with which the knowledge and information attained from a previously designed solder can offer feedback toward further improving the properties of a newly designed one. In practice, In–Sn–Bi nanoparticles engineered on the surface of Sn–Zn micropowders result in pronounced reflowing on a flexible Au‐coated polyethylene terephthalate (PET) substrate even at the low temperature of 110 °C. Depending on their respective concentrations, the incorporation of CuO@CeO₂ nanostructures and poly(3,4‐ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) polymers increases oxidation resistance and electrical conductivity of the modular solder.

中文翻译：

---

具有分层形态和向后兼容性的模块化焊接系统

报道了具有分层形态和微观/纳米特征的模块化焊料系统，其中焊料纳米颗粒分布在模板微粉的表面上。还介绍了辅助纳米结构的核-壳结构，该结构改善了模块化焊料的预期性能。另外，聚合物添加剂不仅可以用作粘合剂（如环氧树脂），而且可以赋予其他功能。通过将所有这些结合起来，可以确定模块化焊料系统能够提高在热敏塑料基板上的可回流性，抗氧化性和导电性。在这方面，通过改变每种成分的结构和组成并采用向后兼容性，可以很容易地对系统进行修改，从先前设计的焊料中获得的知识和信息可以向后兼容，从而可以提供反馈，以进一步改善新设计的焊料的性能。在实践中，即使在110°C的低温下，在Sn-Zn微粉表面上加工的In-Sn-Bi纳米颗粒也会导致在柔软的Au涂层聚对苯二甲酸乙二醇酯（PET）基材上产生明显的回流。取决于它们各自的浓度，CuO @ CeO的掺入 在Sn-Zn超细粉表面上加工的In-Sn-Bi纳米颗粒即使在110°C的低温下也能在柔性的Au涂层聚对苯二甲酸乙二醇酯（PET）基底上产生明显的回流。取决于它们各自的浓度，CuO @ CeO的掺入 在Sn-Zn超细粉表面上加工的In-Sn-Bi纳米颗粒即使在110°C的低温下也能在柔性的Au涂层聚对苯二甲酸乙二醇酯（PET）基底上产生明显的回流。取决于它们各自的浓度，CuO @ CeO的掺入_2个纳米结构和聚（3,4-乙撑二氧噻吩）聚苯乙烯磺酸盐（PEDOT：PSS）聚合物可提高模块化焊料的抗氧化性和导电性。