Abstract Oxidation of AlN ceramic plates was performed via two different techniques of Cu2+ activation followed by oxidation and direct oxidation. Two types of AlN direct bonding copper (DBC) substrates were then fabricated by combining the pre-oxidized Cu foils with the AlN plates. The interface structures, the peel strengths, and the temperature cycling reliabilities of the samples are investigated. The results showed that after Cu2+ activation followed by oxidation, rod-like CuAl2O4 particles were distributed on the dense α-Al2O3 layer oxide layer of the AlN plates. This microstructure is beneficial in improving the interface bonding strength and the wettability of the AlN-DBC substrates. Interface layers of both the AlN-DBC substrates were composed of two sublayers of Cu2O+CuAlO2 and residual Al2O3. During the peeling process, fractures occurred in the AlN plates for the Cu2+ activated and oxidized AlN-DBC substrates, but at the interface layer for the directly oxidized AlN-DBC substrates. The peel strength and the temperature cycling performance of the Cu2+ activated and oxidized AlN-DBC substrates were higher than the directly oxidized AlN-DBC substrates.

中文翻译：

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两种氮化铝直接键合铜基板的微观结构、强度和可靠性的比较研究

摘要 AlN 陶瓷板的氧化是通过 Cu2+ 活化后氧化和直接氧化两种不同的技术进行的。然后通过将预氧化的铜箔与 AlN 板结合来制造两种类型的 AlN 直接键合铜 (DBC) 基板。研究了样品的界面结构、剥离强度和温度循环可靠性。结果表明，经过Cu2+活化和氧化后，棒状CuAl2O4颗粒分布在AlN板致密的α-Al2O3层氧化层上。这种微结构有利于提高AlN-DBC基板的界面结合强度和润湿性。两个 AlN-DBC 基板的界面层均由 Cu2O+CuAlO2 和残留 Al2O3 的两个子层组成。在剥皮过程中，对于 Cu2+ 活化和氧化的 AlN-DBC 基板，在 AlN 板中发生断裂，但对于直接氧化的 AlN-DBC 基板，在界面层发生断裂。Cu2+活化和氧化的AlN-DBC基板的剥离强度和温度循环性能高于直接氧化的AlN-DBC基板。