Abstract Room-temperature fabrication of TiO2/Cu composite films for embedded passive components were attempted via aerosol deposition process. XRD analysis and observation of internal microstructures revealed that TiO2/Cu composite films using 500 nm-sized TiO2 had further tight bonding between particles compared to 25 nm-sized TiO2, due to effect of initial TiO2 particle size on densification of internal microstructures. Then, to optimize their adhesive strength and temperature coefficient of resistance (TCR), electrical and mechanical properties of TiO2 (500 nm)/Cu composite films with different content of TiO2 were evaluated for applications as advanced composite film resistors. Results showed that TiO2/Cu (50 wt%/50 wt%) composite films had sufficient electrical resistivity (5.8 ×10−3 Ω cm), excellent near-zero TCR (−3 ppm/℃), and improved adhesive strength (~ 7.37 N/mm2) resulting from proper coexistence of anchoring bonds and mechanical interlocking formed during deposition.

中文翻译：

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通过气溶胶沉积制备具有接近零 TCR 和高粘合强度的 TiO 2 /Cu 杂化复合薄膜

摘要 尝试通过气溶胶沉积工艺室温制备用于嵌入式无源元件的 TiO2/Cu 复合薄膜。XRD 分析和内部微结构观察表明，由于初始 TiO2 粒径对内部微结构致密化的影响，使用 500 nm 尺寸的 TiO2 的 TiO2/Cu 复合膜与 25 nm 尺寸的 TiO2 相比，颗粒之间的结合更紧密。然后，为了优化它们的粘合强度和电阻温度系数 (TCR)，评估了具有不同 TiO2 含量的 TiO2 (500 nm)/Cu 复合膜的电气和机械性能，用于作为高级复合膜电阻器的应用。结果表明，TiO2/Cu (50 wt%/50 wt%) 复合薄膜具有足够的电阻率 (5.8 ×10−3 Ω cm)，优异的近零 TCR (-3 ppm/℃)，