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Microstructure engineering of graphene towards highly thermal conductive composites
Composites Part A: Applied Science and Manufacturing ( IF 8.7 ) Pub Date : 2018-06-07 , DOI: 10.1016/j.compositesa.2018.06.010
Haoming Fang , Shu-Lin Bai , Ching Ping Wong

Heat management is more and more crucial challenge since the development of modern electronic devices towards miniaturization and high dense integrity. Highly thermal conductive composites based on graphene are ideal heat-dissipating materials for their excellent heat dissipation ability, outstanding mechanical properties as well as low coefficient of thermal expansion. Numerous efforts have been made towards the development of graphene-based polymeric composites with high performance. Furthermore, it has been demonstrated that microstructure engineering of graphene-based construction of three-dimensional networks and high orientation is extremely important to improve the properties of composites. In this review, the research progress on the latest strategies of microstructure engineering of graphene for highly thermal conductive composites is summarized. Both fabrication methods and theoretical simulations are discussed. Finally, development and perspectives of highly thermal conductive composites are presented.



中文翻译:

石墨烯对高导热复合材料的微结构工程

自从现代电子设备向小型化和高密度整体发展以来,热管理已成为越来越关键的挑战。基于石墨烯的高导热复合材料是理想的散热材料,因为它们具有出色的散热能力,出色的机械性能以及低的热膨胀系数。在开发具有高性能的基于石墨烯的聚合物复合材料方面已经做出了许多努力。此外,已经证明,基于石墨烯的三维网络构造和高取向性的微结构工程对于提高复合材料的性能极为重要。在这篇评论中,综述了高导热复合材料石墨烯微结构工程最新策略的研究进展。讨论了制造方法和理论模拟。最后,介绍了高导热复合材料的发展和前景。

更新日期:2018-06-07
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