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Ultraviolet/ozone and oxygen plasma treatments for improving the contact of carbon nanotube thin film transistors
Science Bulletin ( IF 18.9 ) Pub Date : 2018-05-30 , DOI: 10.1016/j.scib.2018.05.029
Qi Huang 1 , Jiye Xia 1 , Jie Zhao 1 , Guodong Dong 1 , Fang Liu 1 , Hu Meng 2 , Xuelei Liang 1
Affiliation  

Carbon nanotube thin film transistor (CNT-TFT) is an emerging technology for future macroelectronics, such as chemical and biological sensors, optical detectors, and the backplane driving circuits for flat panel displays. The mostly reported fabrication method of CNT-TFT is a lift-off based photolithography process. In such fabrication process, photoresist (PR) residue contaminates the interface of tube-metal contact and deteriorates the device performance. In this paper, ultraviolet ozone (UVO) and oxygen plasma treatments were employed to remove the PR contamination. Through our well-designed experiments, the UVO treatment is confirmed an effective way of cleaning contamination at the tube-metal interface, while oxygen plasma treatment is too reactive and hard to control, which is not appropriate for CNT-TFTs. It is determined that 2–6 min UVO treatment is the preferred window, and the best optimized treatment time is 4 min, which leads to 15% enhancement of device performance.



中文翻译:

用于改善碳纳米管薄膜晶体管接触的紫外线/臭氧和氧等离子体处理

碳纳米管薄膜晶体管 (CNT-TFT) 是未来宏电子学的新兴技术,例如化学和生物传感器、光学探测器以及平板显示器的背板驱动电路。报道最多的 CNT-TFT 制造方法是基于剥离的光刻工艺。在这种制造过程中,光刻胶 (PR) 残留物会污染管-金属接触界面并降低器件性能。在本文中,采用紫外线臭氧 (UVO) 和氧等离子体处理来去除 PR 污染。通过我们精心设计的实验,UVO 处理被证实是清洁管-金属界面污染物的有效方法,而氧等离子体处理反应性太强且难以控制,不适用于 CNT-TFT。

更新日期:2018-05-30
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