Abstract The present work investigates the effect of crystal orientation and temperature on the size effect using micro-sized single-crystal bending beams of copper with thicknesses between 1 and 5 μm. Two crystal orientations were studied: {111} for single slip and {111} for multiple slip. The bending tests were carried out with a nanoindenter installed in a scanning electron microscope at temperatures between room temperature and 200 °C. The results show clearly that, besides the phenomenon smaller is stronger, the size effect is influenced by temperature particularly in beams oriented for single slip. We demonstrated that, in the presence of strain gradients, the mechanical response is governed by dislocation pile-ups below a critical beam size, being more pronounced in single slip conditions. The pile-ups, however, collapse by “temperature-induced” cross-slip with increasing temperature, while in bigger samples, dislocation networks govern the strength.

中文翻译：

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单次和多次滑移条件和温度对微弯曲尺寸效应的影响

摘要 本工作使用厚度在 1 到 5 μm 之间的微型单晶铜弯曲梁来研究晶体取向和温度对尺寸效应的影响。研究了两种晶体取向：{111} 用于单滑移和 {111} 用于多次滑移。在室温和 200 °C 之间的温度下，使用安装在扫描电子显微镜中的纳米压痕仪进行弯曲测试。结果清楚地表明，除了现象越小越强外，尺寸效应还受温度的影响，特别是在单滑移取向的梁中。我们证明，在存在应变梯度的情况下，机械响应由低于临界梁尺寸的位错堆积控制，在单滑移条件下更为明显。然而，堆积如山，