The initial stages of Cu electrodeposition and dissolution on an Au(100) electrode in sulfuric acid solution were studied by high-speed atomic force microscopy. Dynamic observations revealed that Cu islands formed on the Au terraces within a few seconds. The islands grew to approximately 100 nm as two thick layers overlapped. The AFM height profile results indicated that each layer consisted of 3–8 atomic layers. Dissolution occurred when an anodic potential was applied, with the bottom layer dissolved preferentially. Correlation of these observations with electrochemical data from cyclic voltammetry indicated differences in the rates of deposition and dissolution.

中文翻译：

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高速原子力显微镜原位观察Cu在Au（100）上的电沉积和溶解

通过高速原子力显微镜研究了Cu电沉积和在Au（100）电极在硫酸溶液中溶解的初始阶段。动态观察表明，在几秒钟内，在金阶上形成了铜岛。当两个厚层重叠时，这些岛长到大约100 nm。AFM高度剖面结果表明，每一层都由3-8个原子层组成。当施加阳极电位时发生溶解，底层优先溶解。这些观察结果与循环伏安法的电化学数据的相关性表明了沉积和溶解速率的差异。