With the rapid development of electronics industry, there is an increasing demand for high performance electronic packaging materials. Furthermore, the high-temperature performance and thermal cycling stability are required owing to the harsher service environment. In this work, Al-50Si alloy was prepared via rapid solidification/powder metallurgy technique, and the tensile properties at elevated temperature and the thermo-physical properties after thermal cycling were investigated. The results show that the tensile strength decreases gradually with the increase in the environmental temperature. Whereas, pullout of the Si particle is seldom observed in the specimens at elevated temperatures owing to the strong interfacial bonding. With the progress of thermal cycling, the coefficient of thermal expansion (CTE) is stable, but the plastic strain increases rapidly at the initial stage. However, the thermal conductivity decreases significantly with the increase in the temperature or the number of thermal cycles. This phenomenon is mainly ascribed to the CTE mismatch between the Al matrix and Si phase. The variation of CTE and thermal conductivity is discussed in terms of thermally induced stress.

随着电子工业的快速发展，对高性能电子包装材料的需求不断增长。此外，由于恶劣的服务环境，需要高温性能和热循环稳定性。在这项工作中，通过快速凝固/粉末冶金技术制备了Al-50Si合金，并研究了高温下的拉伸性能和热循环后的热物理性能。结果表明，随着环境温度的升高，抗拉强度逐渐降低。然而，由于牢固的界面结合，在升高的温度下很少观察到样品中硅颗粒的拉出。随着热循环的进行，热膨胀系数（CTE）稳定，但是塑性应变在初始阶段迅速增加。然而，随着温度或热循环次数的增加，热导率显着降低。这种现象主要归因于Al基体和Si相之间的CTE不匹配。CTE和热导率的变化是根据热应力引起的。