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Kinetic study of electroless cobalt deposition on WC particles
Journal of Alloys and Compounds ( IF 6.2 ) Pub Date : 2018-04-09
L. Guo, X.J. Zhao, L.R. Xiao, C.R. Tang, W.Y. Zhang, X.X. Tu, X.Z. Liu, Y.C. Nie

The cobalt coating with an average thickness of 15–20 nm was uniformly plated on the surface of ultra-fine WC powders by electroless plating in the present work. The effects of electroless plating condition parameters on the deposition rate were studied. It was found that the deposition rate increased with the increase of CoSO4·7H2O content, pH value, complexing agent concentration, and bath temperature, while decreased with the increase of reducing agent (NaH2PO2·H2O) concentration. Furthermore, the cobalt deposition rate empirical equation and activation energy were determined. The results show that the activation energy (Ea) for the electroless cobalt on WC substrates is approximately 54.65 kJ/mol.



中文翻译:

WC颗粒上化学沉积钴的动力学研究

在目前的工作中,通过化学镀将平均厚度为15–20 nm的钴涂层均匀地镀在超细WC粉的表面上。研究了化学镀条件参数对沉积速率的影响。研究发现,沉积速率随CoSO 4 ·7H 2 O含量,pH值,络合剂浓度和浴温的增加而增加,而随还原剂(NaH 2 PO 2 ·H 2 O)浓度的增加而降低。。此外,确定了钴沉积速率的经验方程式和活化能。结果表明,活化能(E a)在WC衬底上的化学镀钴)约为54.65 kJ / mol。

更新日期:2018-04-09
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