Abstract We are utilizing a new method to improve the dielectric properties of a conventional polymer using a recycled polymer product. The polyurethane foams are recycled by glycolysis process and the derived material was applied to improve the dielectric properties of the brittle DGEBA epoxy resin. Two main parameters that determine the applicability of the material as a dielectric (the dielectric constant and dielectric loss), were studied at room temperature for all the blends. The properties like dielectric constant and modulus were found to be very low by the inclusion of the different compositions of recycled polyurethane. 20 phr blend was selected for optimum properties and it shows a lower dissipation factor of 1.5 × 10−2. The blends are advised as good candidates for the use in microelectronics as insulations, encapsulation and or circuit boards. We presented here an easy to process material with all the good properties require for a dielectric material. The thermal and dielectric data showed improvement than the neat polymers. The dielectric data was supported by the low water uptake of 0.5% by 20 phr blend and slightly increased contact angle from 63° to 77°.

中文翻译：

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来自工业废物回收的聚氨酯乙醇酸，用于开发适用于电子产品的低介电常数、热稳定材料

摘要 我们正在利用一种新方法来改善使用回收聚合物产品的常规聚合物的介电性能。聚氨酯泡沫通过糖酵解工艺回收，衍生材料用于改善脆性 DGEBA 环氧树脂的介电性能。在室温下研究了所有混合物的两个主要参数，这些参数决定了材料作为电介质的适用性（介电常数和介电损耗）。通过包含不同的回收聚氨酯组合物，发现诸如介电常数和模量之类的性能非常低。选择 20 phr 混合物以获得最佳性能，它显示出 1.5 × 10-2 的较低损耗因子。建议将这些混合物作为绝缘材料用于微电子产品的良好候选物，封装和/或电路板。我们在此展示了一种易于加工的材料，具有介电材料所需的所有良好特性。热和介电数据显示比纯聚合物有所改善。介电数据得到了 0.5% 的低吸水率和 20 phr 混合物的支持，接触角从 63° 略微增加到 77°。