当前位置: X-MOL 学术Appl. Phys. Lett. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
High quality Al2O3/(100) oxygen-terminated diamond interface for MOSFETs fabrication
Applied Physics Letters ( IF 4 ) Pub Date : 2018-03-05 , DOI: 10.1063/1.5018403
T. T. Pham 1, 2, 3 , M. Gutiérrez 4 , C. Masante 1, 2, 3 , N. Rouger 5 , D. Eon 1, 2 , E. Gheeraert 1, 2, 6 , D. Araùjo 4 , J. Pernot 1, 2, 7
Affiliation  

In this letter, we report on the improvement of gate controlled Al2O3/(100) boron doped (B-doped) oxygen-terminated diamond (O-diamond) Metal Oxide Semiconductor Capacitors using 40 nm thick Al2O3 deposited by Atomic Layer Deposition at 380 °C and then annealed at 500 °C in vacuum conditions. The high quality of Al2O3 and an Al2O3/diamond interface is verified thanks to electrical measurements and Transmission Electron Microscopy (TEM) measurements. A density of interface states lower than 1012 eV−1 cm−2 is measured from the flat-band regime to the depletion regime. The shift of the flat-band voltage and the leakage current through the oxide are significantly reduced in good agreement with the mono-crystalline character of the Al2O3 layer revealed by TEM.In this letter, we report on the improvement of gate controlled Al2O3/(100) boron doped (B-doped) oxygen-terminated diamond (O-diamond) Metal Oxide Semiconductor Capacitors using 40 nm thick Al2O3 deposited by Atomic Layer Deposition at 380 °C and then annealed at 500 °C in vacuum conditions. The high quality of Al2O3 and an Al2O3/diamond interface is verified thanks to electrical measurements and Transmission Electron Microscopy (TEM) measurements. A density of interface states lower than 1012 eV−1 cm−2 is measured from the flat-band regime to the depletion regime. The shift of the flat-band voltage and the leakage current through the oxide are significantly reduced in good agreement with the mono-crystalline character of the Al2O3 layer revealed by TEM.

中文翻译:

用于 MOSFET 制造的高质量 Al2O3/(100) 氧封端金刚石界面

在这封信中,我们报告了栅极控制的 Al2O3/(100) 硼掺杂(B 掺杂)氧封端金刚石(O-金刚石)金属氧化物半导体电容器的改进,该电容器使用 40 nm 厚的 Al2O3 通过原子层沉积以 380°沉积C,然后在真空条件下在 500°C 下退火。由于电测量和透射电子显微镜 (TEM) 测量,验证了 Al2O3 和 Al2O3/金刚石界面的高质量。从平带状态到耗尽状态测量低于 1012 eV-1 cm-2 的界面态密度。平带电压的偏移和通过氧化物的漏电流显着降低,与 TEM 显示的 Al2O3 层的单晶特性非常吻合。在这封信中,我们报告了栅极控制的 Al2O3/(100) 掺硼(B 掺杂)氧端基金刚石(O-金刚石)金属氧化物半导体电容器的改进,使用 40 nm 厚的 Al2O3 通过原子层沉积在 380°C 下沉积,然后退火在 500 °C 的真空条件下。由于电测量和透射电子显微镜 (TEM) 测量,验证了 Al2O3 和 Al2O3/金刚石界面的高质量。从平带状态到耗尽状态测量低于 1012 eV-1 cm-2 的界面态密度。平带电压的偏移和通过氧化物的漏电流显着降低,与 TEM 显示的 Al2O3 层的单晶特性非常吻合。
更新日期:2018-03-05
down
wechat
bug