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Decreasing the dielectric constant and water uptake of co-polyimide films by introducing hydrophobic cross-linked networks
European Polymer Journal ( IF 6 ) Pub Date : 2018-04-01 , DOI: 10.1016/j.eurpolymj.2018.02.024
Ningning Song , Kaixiang Shi , Huaxuan Yu , Hongyan Yao , Tengning Ma , Shiyang Zhu , Yunhe Zhang , Shaowei Guan

Abstract In the present study, a series of pendant-group cross-linkable co-polyimide (Co-PI) films were successfully prepared. Via thermal treatment, the cross-linkable tetrafluorostyrol pendant-groups could induce cross-linking without any chemical additives, resulting in the formation of robust cross-linked structures in the co-polyimide films. The effects of cross-linking and the amount of cross-linkable pendant-groups on the performances of co-polyimide films were studied and discussed in detail. After cross-linking, the obtained films showed the significantly lowered dielectric constants, which decreased gradually with increasing amounts of cross-linkable pendant-groups. The best dielectric properties were obtained for cross-linked Co-PI-5 film, which exhibits a dielectric constant as low as 2.48 at 1 MHz. Meanwhile, the cross-linked Co-PI-5 film demonstrated excellent moisture resistance with a water uptake of less than 0.31%. It also exhibited outstanding thermal and dimensional stability, superior chemical resistance, excellent mechanical property and surface planarity. The low dielectric constants, excellent anti-moisture performances and outstanding comprehensive properties make the cross-linked Co-PIs a good candidate for interlayer dielectrics in the near future.

中文翻译:

通过引入疏水性交联网络降低共聚酰亚胺薄膜的介电常数和吸水率

摘要 在本研究中,成功​​制备了一系列侧基可交联共聚酰亚胺(Co-PI)薄膜。通过热处理,可交联的四氟苯乙烯侧基可以在没有任何化学添加剂的情况下诱导交联,从而在共聚酰亚胺薄膜中形成坚固的交联结构。详细研究和讨论了交联和可交联侧基对共聚酰亚胺薄膜性能的影响。交联后,所得薄膜的介电常数显着降低,随着可交联侧基数量的增加,介电常数逐渐降低。交联的 Co-PI-5 薄膜获得了最好的介电性能,其在 1 MHz 下的介电常数低至 2.48。同时,交联的 Co-PI-5 薄膜表现出优异的防潮性,吸水率低于 0.31%。它还表现出出色的热稳定性和尺寸稳定性、优异的耐化学性、优异的机械性能和表面平整度。低介电常数、优异的防潮性能和出色的综合性能使交联的 Co-PI 在不久的将来成为层间电介质的良好候选者。
更新日期:2018-04-01
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