Both aminopropylisobutyl polyhedral oligomeric silsesquioxane (NH₂-POSS) and hydrazine monohydrate were utilized to functionalize graphene oxide (GO), and to obtain chemically modified graphene (CMG), which was then used for preparing thermally conductive CMG/polyimide (CMG/PI) nanocomposites via a sequential in situ polymerization and electrospinning-hot press technology. NH₂-POSS molecules were grafted on the GO surface, and CMG was obtained by the reaction between NH₂-POSS and GO. The thermal conductivity coefficient (λ), glass transition temperature (T_g) and heat resistance index (T_HRI) of the prepared CMG/PI nanocomposites were all increased with increasing the CMG loading. The λ value of the CMG/PI nanocomposites with 5 wt% CMG was significantly improved to 1.05 W m⁻¹ K⁻¹, about 4 times higher than that of the pristine PI matrix (0.28 W m⁻¹ K⁻¹). The corresponding T_g and T_HRI values were also increased to 213.0 and 282.3 °C, respectively. Moreover, an improved thermal conductivity model was proposed and predicted the λ values of the nanocomposites more precisely than those obtained from the typical Maxwell, Russell and Bruggemen classical models.

中文翻译：

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通过原位聚合和静电纺丝-热压技术 显着增强和精确建模了化学改性石墨烯的聚酰亚胺纳米复合材料的导热系数

氨基丙基异丁基多面体低聚倍半硅氧烷（NH ₂ -POSS）和肼一水合物均用于官能化氧化石墨烯（GO），并获得化学改性的石墨烯（CMG），然后将其用于制备导热CMG /聚酰亚胺（CMG / PI）通过顺序原位聚合和静电纺丝-热压技术制备纳米复合材料。将NH ₂ -POSS分子接枝在GO表面上，并且通过NH ₂ -POSS与GO之间的反应获得CMG 。导热系数（λ），玻璃化转变温度（T _g）和耐热指数（T _HRI）所制备的CMG / PI纳米复合材料的）均随CMG负载的增加而增加。具有5重量％的CMG的CMG / PI纳米复合材料的λ值显着提高至1.05W m ^-1 K ^-1，比原始PI基质（0.28W m ^-1 K ^-1）高约4倍。相应的T _g和T _HRI值也分别提高到213.0和282.3°C。此外，提出了一种改进的导热系数模型，并比从典型的Maxwell，Russell和Bruggemen经典模型获得的值更精确地预测了纳米复合材料的λ值。