An electronic (e‐) skin is expected to experience significant wear and tear over time. Therefore, self‐healing stretchable materials that are simultaneously soft and with high fracture energy, that is high tolerance of damage or small cracks without propagating, are essential requirements for the realization of robust e‐skin. However, previously reported elastomers and especially self‐healing polymers are mostly viscoelastic and lack high mechanical toughness. Here, a new class of polymeric material crosslinked through rationally designed multistrength hydrogen bonding interactions is reported. The resultant supramolecular network in polymer film realizes exceptional mechanical properties such as notch‐insensitive high stretchability (1200%), high toughness of 12 000 J m⁻², and autonomous self‐healing even in artificial sweat. The tough self‐healing materials enable the wafer‐scale fabrication of robust and stretchable self‐healing e‐skin devices, which will provide new directions for future soft robotics and skin prosthetics.

中文翻译：

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坚韧且对水不敏感的自修复弹性体，可打造坚固的电子皮肤

预计电子（e-）皮肤会随着时间的流逝而遭受严重磨损。因此，同时具有柔软性和高断裂能（即对损伤或小裂纹的耐受性高而不扩散）的自愈可拉伸材料是实现坚固的皮肤的必要条件。但是，先前报道的弹性体，尤其是自修复聚合物大多是粘弹性的，并且缺乏高的机械韧性。在此，报道了通过合理设计的多强度氢键相互作用而交联的新型聚合物材料。聚合物薄膜中形成的超分子网络实现了卓越的机械性能，例如不敏感的高拉伸性（1200％），12,000 J m ^-2的高韧性，甚至在人工流汗的情况下也能自动自我修复。坚韧的自我修复材料可以在晶圆级制造出坚固且可拉伸的自我修复电子皮肤设备，这将为未来的软机器人和皮肤修复提供新的方向。