Biodegradable electronic systems represent an emerging class of technology with unique application possibilities, from temporary biomedical implants to “green” consumer gadgets. This paper introduces materials and processing methods for 3D, heterogeneously integrated devices of this type, with various functional examples in sophisticated forms of silicon‐based electronics. Specifically, techniques for performing multilayer assembly by transfer printing and for fabricating layer‐to‐layer vias and interconnects by lithographic procedures serve as routes to biodegradable, 3D integrated circuits composed of functional building blocks formed using specialized approaches or sourced from commercial semiconductor foundries. Demonstration examples range from logic gates and analog circuits that undergo functional transformation by transience to systems that integrate multilayer resistive sensors for in situ, continuous electrical monitoring of the processes of transience. The results significantly expand the scope of engineering options for biodegradable electronics and other types of transient microsystem technologies.

中文翻译：

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3D，异构集成格式的可生物降解电子系统

可生物降解的电子系统代表了新兴的一类技术，具有独特的应用可能性，从临时性生物医学植入物到“绿色”消费电子产品。本文介绍了用于此类3D异构集成设备的材料和处理方法，并以复杂的基于硅的电子形式提供了各种功能示例。具体来说，通过转移印刷执行多层组装以及通过光刻工艺制造层到层通孔和互连的技术，可作为通往可生物降解的3D集成电路的途径，该3D集成电路由使用特殊方法形成或源自商业半导体铸造厂的功能构建块组成。演示示例包括通过瞬态进行功能转换的逻辑门和模拟电路，以及集成了多层电阻传感器以对瞬态过程进行原位连续电监控的系统。结果大大扩展了可生物降解电子产品和其他类型的瞬态微系统技术的工程选择范围。