A solid silver-ligand complex, μ-oxolato-bis(ethylenediaminesilver(I)), was developed for formulating particle-free conductive metal–organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 × 10^–8 Ω m, which is 2.7 times that of bulk silver. One-pot complex synthesis yielded an easily isolated, and stable, solid product that can be formulated when needed thereby improving shelf life.

中文翻译：

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具有增强的固化条件的柔性草酸反应性草酸银油墨组合物

开发了一种固态的银-配体配合物，μ-氧杂双-（乙二胺银（I）），用于配制无颗粒的导电金属有机分解（MOD）喷墨油墨。该配合物既具有高摩尔含量的银，又具有在喷墨相容性极性溶剂中的溶解度。显影了具有29.5 wt％的银含量的水性油墨配方，并将其喷墨印刷在玻璃，聚对苯二甲酸乙二酯和聚酰亚胺基材上。提出了一种新的混合热光子固化方法，该方法可显着改善电气性能和基材附着力。经测量，银导电迹线的体电阻率为4.26×10 ^–8Ωm，是散装银的2.7倍。一锅法复杂的合成产生了一种易于分离且稳定的固体产物，可以在需要时进行配制，从而提高了货架期。