Abstract Electrical conductivity (σ) and mechanical properties are two major concerns for layer-structured films used in electronic devices. It is unavoidable to significantly reduce the mechanical integrity of layer-structured films for adjoined conducting-layer and polymer layer and also greatly increase the cost for expensive conductive fillers in order to enhance σ by simply increasing conducting filler content. This paper reports for the first time the preparation of silver nanowire (Ag-NW)/polyimide (PI) layer-structured composite films with greatly enhanced σ and maintained good mechanical properties by polyaniline (PANI) utilized in the PI substrate layer to regulate its potential barrier for the purpose of reducing the tunnelling resistance between Ag-NWs. Consequently, σ is greatly enhanced by up to 8.7 times (over 1000 S/cm) while the high tensile strength of the layer-structured conducting composite film is maintained by 95% (over 75 MPa) via introduction of PANI at low contents up to 20% of PI. This work provides a simple strategy for development of high-quality thin films for electronic devices simultaneously possessing high σ and good mechanical properties.

中文翻译：

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聚苯胺显着提高层状结构银纳米线/聚酰亚胺复合膜的导电性

摘要 电导率 (σ) 和机械性能是电子设备中使用的层状结构薄膜的两个主要问题。不可避免地会显着降低相邻导电层和聚合物层的层状结构薄膜的机械完整性，并且还大大增加了昂贵的导电填料的成本，以通过简单地增加导电填料含量来提高 σ。本文首次报道了通过在 PI 基底层中使用聚苯胺 (PANI) 来调节其 σ 值并保持良好机械性能的银纳米线 (Ag-NW)/聚酰亚胺 (PI) 层状结构复合薄膜的制备。以降低 Ag-NW 之间的隧道电阻为目的的势垒。因此，σ 大大提高了 8 倍。7 倍（超过 1000 S/cm）而通过引入低含量的 PANI（高达 20% 的 PI），层状结构导电复合膜的高拉伸强度保持了 95%（超过 75 MPa）。这项工作为开发用于同时具有高 σ 和良好机械性能的电子设备的高质量薄膜提供了一种简单的策略。