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Copper Phthalocyanine as Contact Layers for Pentacene Films Grown on Coinage Metals
The Journal of Physical Chemistry C ( IF 3.7 ) Pub Date : 2018-01-19 00:00:00 , DOI: 10.1021/acs.jpcc.7b10324
Alexander Mänz 1 , Alrun Aline Hauke 1 , Gregor Witte 1
Affiliation  

The metal–semiconductor interface determines the efficiency of charge carrier injection into any organic electronics device. Control of this interface, its structure, and its morphology is therefore essential for device improvement. In this study, we analyze the approach of controlling semiconductor morphology at this interface by insertion of a copper phthalocyanine (CuPc) monolayer as a primer between Ag(111), Au(111), and Cu(100) surfaces and the organic semiconductor pentacene (PEN). Controlled monolayer formation is facilitated by thermal desorption of excess multilayers, monitored via thermal desorption spectroscopy (TDS), X-ray photoelectron spectroscopy (XPS) and scanning tunneling microscopy (STM), and the growth of PEN on the resultant monolayer primers is investigated by near-edge X-ray absorption spectroscopy (NEXAFS), atomic force microscopy (AFM) and STM. While well-ordered CuPc monolayers with flat-lying molecules are formed on Au(111) and Ag(111), no long-range order is observed on Cu(100). Subsequently deposited PEN molecules initially adopt a recumbent orientation with their long axis oriented parallel to the surface, while upon further deposition this structure is metastable as molecules adopt an upright orientation beyond the bilayer and form (001) oriented films. Although the recumbent orientation of the CuPc primer layer is not transferred to thicker PEN films, which is attributed to the geometrical inequality of the two molecules, a distinct dewetting, as found for PEN films grown on bare metal surfaces, is efficiently suppressed. This effect is reproducible even for polycrystalline Au surfaces, which resemble the situation of metal contacts in devices.

中文翻译:

铜酞菁用作造币金属上生长的并五苯薄膜的接触层

金属-半导体界面决定了载流子注入任何有机电子设备的效率。因此,对该接口,其结构及其形态的控制对于设备改进至关重要。在这项研究中,我们通过在Ag(111),Au(111)和Cu(100)表面与有机半导体并五苯之间插入底漆铜酞菁(CuPc)单层作为底漆,来分析控制该界面处的半导体形态的方法(笔)。多余多层的热脱附可促进受控的单层形成,可通过热脱附光谱(TDS),X射线光电子能谱(XPS)和扫描隧道显微镜(STM)进行监控,并通过以下方法研究PEN在所得单层底漆上的生长近边缘X射线吸收光谱(NEXAFS),原子力显微镜(AFM)和STM。尽管在Au(111)和Ag(111)上形成了具有平坦分子的有序CuPc单分子膜,但在Cu(100)上没有观察到长程有序。随后沉积的PEN分子最初采用横卧方向,其长轴与表面平行,而在进一步沉积时,此结构是亚稳的,因为分子在双层之外形成了直立的取向,并形成(001)取向的薄膜。尽管CuPc底漆层的倾斜方向没有转移到较厚的PEN膜上,这归因于两个分子的几何不等式,但有效抑制了裸露在金属表面上的PEN膜的明显脱湿。即使对于多晶金表面,该效果也是可重现的,
更新日期:2018-01-19
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