This paper presents 3D‐integrated and multifunctional all‐soft physical microsystems, which are composed of a soft sensor, a soft interconnector, and a soft readout circuit. The microsystems utilize gallium‐based liquid metal (eutectic gallium‐indium alloy, EGaIn) and poly(dimethylsiloxane) (PDMS) and are fabricated using an advanced EGaIn thin‐line patterning technique based on soft lithography. Combining the scalable fabrication process and a vertical integration approach using EGaIn‐filled soft vias, two types of all‐soft physical microsystems are investigated using analytical, numerical, and experimental approaches and demonstrated to highlight high‐density integration, multifunctional sensing capability, as well as system‐level flexibility and stretchability: (i) a finger‐mountable strain sensing microsystem with reduced temperature sensitivity and (ii) a fingertip microsystem for simultaneous proximity, touch, and pressure sensing. The demonstrated fabrication and integration approaches provide a path towards all‐soft and highly integrated wearable physical microsystems for human‐machine interfaces, soft robotics, and healthcare applications.

中文翻译：

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基于液态金属的3D集成多功能全物理物理微系统，用于电子皮肤应用

本文介绍了3D集成且多功能的全软物理微系统，该系统由软传感器，软互连器和软读出电路组成。该微系统利用镓基液态金属（共晶镓铟合金EGaIn）和聚二甲基硅氧烷（PDMS），并使用基于软光刻技术的先进EGaIn细线构图技术制造而成。结合可扩展的制造工艺和使用EGaIn填充的软通孔的垂直集成方法，使用分析，数值和实验方法研究了两种类型的全软物理微系统，并展示了其突出的高密度集成，多功能感测功能以及作为系统级的灵活性和可扩展性：（i）温度敏感度降低的可手指安装的应变传感微系统，以及（ii）用于同时接近，触摸和压力传感的指尖微系统。演示的制造和集成方法为通向人机界面，软机器人技术和医疗保健应用的全软和高度集成的可穿戴物理微系统提供了一条途径。