Abstract This study explores the usage of resorcinol based phthalonitrile (rPN) in harsh environment electronics encapsulation applications. rPN itself exhibits excellent properties as a high temperature polymeric molding compound in terms of mechanical properties and thermal stability. Its properties improve with thermal aging, outperforming other traditional polymers at operational temperatures close to 300 °C. Optimal bond shear strength of rPN is achieved when used as a monomer or pre-polymer with a low melting point of 180 °C, which is compatible with today's electronic packaging processes. The hybrid polymer of rPN with fillers, such as silica or alumina, has a coefficient of thermal expansion (CTE) which is highly tunable, allowing the rPN to have strong adhesion to the underlying substrates and chips. The properties of the rPN hybrid polymer is the result of strong bond interactions between rPN and the fillers, as verified by Fourier Transform Infrared Spectroscopy (FTIR) and Density Functional Theory (DFT) studies. We further demonstrate the integration of the rPN hybrid polymer onto dual-in-line packages (DIPs), which did not fail when subjected to an extreme environment of 310 °C at 190 MPa. This new polymer matrix composite may thus revolutionize the existing thermal-mechanical limits of plastic electronics packaging for extreme environment.

中文翻译：

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用于极端环境电子封装的新型高温聚合物封装材料

摘要 本研究探讨了间苯二酚基邻苯二甲腈 (rPN) 在恶劣环境电子封装应用中的使用。rPN 本身作为高温聚合物模塑料在机械性能和热稳定性方面表现出优异的性能。它的性能随着热老化而改善，在接近 300 °C 的操作温度下性能优于其他传统聚合物。rPN 作为单体或预聚物使用时可实现最佳的键剪切强度，熔点低至 180 °C，与当今的电子封装工艺兼容。rPN 与填料（如二氧化硅或氧化铝）的混合聚合物具有高度可调的热膨胀系数 (CTE)，使 rPN 对底层基板和芯片具有很强的附着力。rPN 杂化聚合物的特性是 rPN 与填料之间强键相互作用的结果，如傅立叶变换红外光谱 (FTIR) 和密度泛函理论 (DFT) 研究所证实的那样。我们进一步证明了 rPN 杂化聚合物与双列直插式封装 (DIP) 的集成，在 310 °C 和 190 MPa 的极端环境下不会失效。因此，这种新型聚合物基复合材料可能会彻底改变塑料电子封装在极端环境下的现有热机械限制。在 310 °C 和 190 MPa 的极端环境中没有失效。因此，这种新型聚合物基复合材料可能会彻底改变塑料电子封装在极端环境下的现有热机械限制。在 310 °C 和 190 MPa 的极端环境中没有失效。因此，这种新型聚合物基复合材料可能会彻底改变塑料电子封装在极端环境下的现有热机械限制。