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Poly (ether ether ketone) - Silicon carbide composite adhesives for elevated temperature applications of stainless steel joints
Composites Science and Technology ( IF 9.1 ) Pub Date : 2018-02-01 , DOI: 10.1016/j.compscitech.2017.12.004
Ajay Kumar Kadiyala , Jayashree Bijwe

Abstract In the present work, the performance of a series of adhesives based on poly (ether ether ketone) (PEEK)/reinforced with micro-sized silicon carbide (SiC) particles for metal-metal joints was investigated. The size effect for SiC particles was studied by developing two composite adhesives with 3 wt. % of nanoparticles (NPs) (50–60 nm), and other with an equal amount of microparticles (MPs) (20 μm). The influence of particles on retention of adhesive strength at elevated temperature was studied in detail. The inclusion of MPs increased the bond strength of adhesives almost by 2 times and 15 wt. % was found to be optimum. At elevated temperatures, the adhesive strength decreased for all compositions. Interestingly the adhesive strength of composite adhesive at 300 °C was similar to the adhesive strength of virgin PEEK at ambient temperature. MPs performed better than NPs, which was correlated to agglomeration and shape of particles. SEM studies revealed that inclusion of hard fillers led to crack growth inhibition and resisting shearing during lap shear test of joints.

中文翻译:

聚(醚醚酮)-碳化硅复合粘合剂,用于不锈钢接头的高温应用

摘要 在目前的工作中,研究了一系列基于聚醚醚酮 (PEEK)/微尺寸碳化硅 (SiC) 颗粒增强的金属-金属接头粘合剂的性能。通过开发两种 3 重量%的复合粘合剂研究了 SiC 颗粒的尺寸效应。纳米粒子 (NPs) 的百分比 (50–60 nm),以及其他等量微粒 (MPs) (20 μm)。详细研究了颗粒对高温下粘合强度保持率的影响。MP 的加入使粘合剂的粘合强度几乎提高了 2 倍和 15 重量%。发现 % 是最佳的。在升高的温度下,所有组合物的粘合强度都降低。有趣的是,复合粘合剂在 300 °C 时的粘合强度与环境温度下原始 PEEK 的粘合强度相似。MPs 的性能优于 NPs,这与颗粒的团聚和形状有关。SEM 研究表明,在接头的搭接剪切试验中,硬填料的加入会导致裂纹扩展抑制和抗剪切。
更新日期:2018-02-01
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