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Stable Na plating/stripping electrochemistry realized by a 3D Cu current collector with thin nanowires
Chemical Communications ( IF 4.9 ) Pub Date : 2017-11-07 00:00:00 , DOI: 10.1039/c7cc07485a
Yanying Lu 1, 2, 3, 4, 5 , Qiu Zhang 1, 2, 3, 4, 5 , Mo Han 1, 2, 3, 4, 5 , Jun Chen 1, 2, 3, 4, 5
Affiliation  

Current collectors have a significant role in Na plating and stripping. Here we demonstrate that a three-dimensional (3D) Cu current collector with thin nanowires (<40 nm) can significantly promote the electrochemical deposition stability of Na via tuning a Na metal plating model, therefore contributing to a high efficiency, long lifespan, and low overpotential during electrode/battery cycling.

中文翻译:

通过带有细纳米线的3D Cu集电器实现稳定的Na镀/剥离电化学

集电器在镀钠和剥离中具有重要作用。在这里,我们证明具有纳米线(<40 nm)的三维(3D)Cu集电器可以通过调整Na金属镀层模型来显着提高Na的电化学沉积稳定性,因此有助于提高效率,延长使用寿命和降低能耗。电极/电池循环过程中的低过电位。
更新日期:2017-11-17
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