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Electrical-based delamination crack monitoring in composites using z-pins
Composites Part A: Applied Science and Manufacturing ( IF 8.7 ) Pub Date : 2017-10-23 , DOI: 10.1016/j.compositesa.2017.10.025
F. Pegorin , K. Pingkarawat , A.P. Mouritz

The in-situ, real-time detection of delamination cracks in composite materials using z-pins is reported. Carbon fibre-epoxy composites were reinforced in the through-thickness direction with different volume content (up to 4%) or material type (composite, metal) of z-pins. Z-pins can reduce the through-thickness electrical resistivity of composites by several orders of magnitude (up to ∼106), depending on their volume content and electrical properties. Z-pins create an electrically conductive pathway through-the-thickness of the otherwise resistive composite material (with an electrical resistivity of about 1.25 Ω m). Mode I interlaminar tests performed under static fracture and cyclic fatigue load conditions reveal that z-pins can be used to detect delamination cracking via changes to the electrical resistivity. The sensitivity of z-pins to changes in the resistivity caused by crack growth is influenced by their volume content, electrical conductivity and interfacial bonding with the composite material.



中文翻译:

使用Z销监控复合材料中的基于电气的分层裂纹

据报道,使用z销可实时,实时地检测复合材料中的分层裂纹。碳纤维-环氧树脂复合材料在厚度方向上以不同的z钉体积含量(最高4%)或材料类型(复合材料,金属)进行了增强。Z引脚可以将复合材料的全厚度电阻率降低几个数量级(最高约10 6),具体取决于其体积含量和电性能。Z引脚在其他方式的电阻性复合材料的厚度范围内形成导电路径(电阻率约为1.25Ωm)。在静态断裂和循环疲劳载荷条件下进行的I型层间测试表明,Z形销可用于通过电阻率的变化检测分层裂纹。z引脚对由裂纹扩展引起的电阻率变化的敏感性受其体积含量,电导率和与复合材料的界面结合的影响。

更新日期:2017-10-23
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