Abstract Transient liquid phase (TLP) diffusion bonding has been achieved for the dissimilar joining of ceramic Al 2 O 3 and copper using Al/Ni multilayers as interlayers at low temperature. The freestanding Al/Ni nano-multilayers were deposited by direct current magnetron sputtering and their properties were studied by X-ray diffraction, differential scanning calorimetry and scanning electron microscopy (SEM). The joining experiments were carried out at 550, 650 and 750 °C for a holding time of 30 min without extra pressure under nitrogen protection. The interfacial microstructure and microstructural characterization of the diffusion welded joints were investigated by SEM, energy dispersive X-ray spectroscopy and element mapping. The effectiveness of different temperatures for the mechanical properties of the joints was evaluated by shear strength. In the present work, an AuSn solder was added to expand the surface contact of the welding. The results show that the applications of Ni/Al multilayers and the AuSn solder reduce the bonding temperature and improve the joining quality.

中文翻译：

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Al/Ni纳米多层膜对铜和陶瓷Al 2 O 3 的瞬态液相键合

摘要 使用Al/Ni 多层膜作为中间层在低温下实现了陶瓷Al 2 O 3 和铜的异种接合的瞬态液相(TLP) 扩散键合。通过直流磁控溅射沉积了独立的 Al/Ni 纳米多层膜，并通过 X 射线衍射、差示扫描量热法和扫描电子显微镜 (SEM) 研究了它们的性能。在氮气保护下，在没有额外压力的情况下，在 550、650 和 750 °C 下进行连接实验，保持时间为 30 分钟。通过扫描电镜、能量色散X射线光谱和元素映射研究了扩散焊接接头的界面微观结构和微观结构表征。通过剪切强度评估不同温度对接头机械性能的有效性。在目前的工作中，添加了 AuSn 焊料以扩大焊接的表面接触。结果表明，Ni/Al多层膜和AuSn焊料的应用降低了接合温度并提高了接合质量。