Abstract Electrical and electronic applications of carbon nanotube (CNT) fibers require new methods to join them with other live parts of the circuits electrically and mechanically. In this study, the meniscus-confined localized electrochemical deposition (LECD) from a simple aqueous electrolyte was developed as a feasible method to precisely join CNT fibers with copper substrates in an open air environment successfully. During the LECD process, the meniscus remained stable without extending along the fiber surface. The deposited joints have regular shapes and clear boundaries with sizes close to the dispensing nozzle size. The copper deposit with a uniform and compact microstructure clings tightly to the fiber surface, with a distinct interface forming between the copper deposit and the fiber, even though the fiber surface is uneven. The original CNT network morphology remains largely unaffected. The joint surface roughness can be as low as 79.67 nm. The electrical resistance of an individual joint was evaluated to be 1.35 Ohms. With thick enough copper deposit, it can be considered that the joint has a tensile strength of more than 200 MPa. Moreover, this joining method has showed a considerable tolerance for the initial gap between the fiber and the substrate surface.

中文翻译：

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一种将碳纳米管纤维与金属基材连接的新方法

摘要 碳纳米管 (CNT) 纤维的电气和电子应用需要新的方法以电气和机械方式将它们与电路的其他带电部件连接起来。在这项研究中，开发了来自简单水性电解质的弯液面限制的局部电化学沉积 (LECD)，作为一种可行的方法，可以在露天环境中成功地将 CNT 纤维与铜基材精确连接。在 LECD 过程中，弯液面保持稳定而不沿纤维表面延伸。沉积的接头具有规则的形状和清晰的边界，其尺寸接近于分配喷嘴的尺寸。具有均匀致密微观结构的铜沉积物紧紧地附着在纤维表面，即使纤维表面不平整，铜沉积物和纤维之间也形成了明显的界面。原始的 CNT 网络形态在很大程度上不受影响。接头表面粗糙度可低至 79.67 nm。单个接头的电阻评估为 1.35 欧姆。有足够厚的铜沉积，可以认为接头具有200 MPa以上的抗拉强度。此外，这种连接方法对光纤和基材表面之间的初始间隙显示出相当大的公差。