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Lowering Band Gap of an Electroactive Metal–Organic Framework via Complementary Guest Intercalation
ACS Applied Materials & Interfaces ( IF 9.5 ) Pub Date : 2017-09-15 00:00:00 , DOI: 10.1021/acsami.7b07292
Zhiyong Guo 1 , Dillip K. Panda 2 , Monica A. Gordillo 2 , Amina Khatun 2 , Hui Wu 3 , Wei Zhou 3 , Sourav Saha 2
Affiliation  

A new honeycomb-shaped electroactive metal–organic framework (MOF) has been constructed from an electron deficient naphthalenediimide (NDI) ligand equipped with two terminal salicylic acid groups. π-Intercalation of electron-rich planar tetrathiafulvalene (TTF) guests between the NDI ligands stacked along the walls lowers the electronic band gap of the material by ca. 1 eV. An improved electron delocalization through the guest-mediated π-donor/acceptor stacks is attributed to the diminished band gap of the doped material, which forecasts an improved electrical conductivity.

中文翻译:

通过互补的客体插层降低电活性金属-有机骨架的带隙

一种新的蜂窝状电活性金属-有机骨架(MOF)由具有两个末端水杨酸基团的缺电子萘二酰亚胺(NDI)配体构建而成。沿壁堆积的NDI配体之间的富电子平面四硫富瓦烯(TTF)客体的π插入使材料的电子能带隙降低了约1。1 eV。通过客体介导的π-供体/受体叠层改善的电子离域作用归因于掺杂材料的带隙减小,这预示了改善的电导率。
更新日期:2017-09-15
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