Polystyrene-wrapped boron nitride/commercial polystyrene ([email protected]/CPS) composites with high thermal conductivity were fabricated by a novel approach. The route included two steps, [email protected] core-shell structured fillers were prepared by using modified BN and styrene (St) as the raw materials via suspension polymerization, and then the [email protected] were kneaded with the CPS by mechanically mixed method. The composite achieves a high thermal conductivity of 0.692 W/mK containing 30 wt% [email protected] (∼15.9 wt% BN), which is 3.72 times higher than that of pure CPS of ∼0.186 W/mK and 1.78 times higher than that BN/CPS blend composite with at the same BN loading of 0.332 W/mK. Compared with traditional routes, the novel preparation process requires less BN fillers when improving the same thermal conductivity. Importantly, other polymers can also encapsulate BN through this strategy, which paves a new way for preparing thermally conductive polymer-matrix composites.

通过一种新颖的方法，制备了具有高导热率的聚苯乙烯包裹的氮化硼/商业聚苯乙烯（[电子邮件保护] / CPS）复合材料。该路线包括两个步骤，以改性的BN和苯乙烯（St）为原料，通过悬浮聚合制备[电子邮件保护的]核壳结构填料，然后通过机械混合法将[电子邮件保护的]与CPS捏合。 。该复合材料实现了0.692 W / mK的高导热率，其中包含30 wt％[受电子邮件保护]（约15.9 wt％BN），这比纯CPS约0.186 W / mK的热导率高3.72倍，比纯CPS的高1.78倍。在0.332 W / mK的相同BN负载下的BN / CPS共混复合材料。与传统方法相比，新颖的制备方法在提高相同的导热率时需要更少的BN填料。重要的，