Abstract

The controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nanoindentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nanojoining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire bonding might present opportunities for nanoscale packaging and nanodevice design.

Graphical Abstract

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摘要

在室温下实现了单个 Ag 纳米线到 Au 电极的可控引线键合。使用纳米压痕由压力引起的塑性变形可以破坏银纳米线表面的保护性有机壳，并引起原子接触，从而促进银和金界面的扩散和纳米连接。变形后在银纳米线中观察到严重的滑移带。在界面处形成金属键，Ag 扩散到 Au 中比 Au 扩散到 Ag 中更多。这种纳米级引线键合可能为纳米级封装和纳米器件设计提供机会。

图形概要

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