There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show...

中文翻译：

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混合电路的增材制造

人们对使用增材制造组件开发功能性电子产品的兴趣日益浓厚。在材料选择和形成混合电路和器件的途径方面的考虑必须证明有用的电子功能；必须启用集成；并且必须补充结构复杂、低成本、高容量和高功能的结构，但通常是电子无源增材制造组件。本文回顾了工业和研究/开发中使用的几种新兴技术，以提供制造多层混合电路或器件的集成优势。首先，我们回顾了一种无掩模、非接触、直接写入 (DW) 技术，该技术在用于电互连的金属胶体墨水沉积方面表现出色。其次，我们回顾了一种补充技术，气溶胶沉积 (AD)，它擅长将金属和陶瓷粉末沉积为坚固的厚敷形涂层，并且还可以通过掩模进行图案化。最后，我们展示...